Abstract: The invention related to a device for supporting a miniaturized, especially electronic or optical component, including a first and a second part, the second part is affixed to the first part on one side at a fixing point, in a cantilevered manner, and supports the component. The projection of the support area of the component onto the first part lies between the fixing point and a predetermined point of reference on the first part. The position of the support area of the component on the second part is chosen in relation to the fixing point between the first and second part and the respective material for the first and second parts is chosen with a specific temperature-dependent expansion coefficient &agr;1 and &agr;2, in such a way that the influence of the temperature-dependent expansion of the first and second part on the position of the support area of the component is at least partially offset in relation to the point of reference.

Abstract: A process for fastening a miniaturized component (2), in particular assembled in a modular manner, on a baseplate (1) by a solder joint is described. A side (4) of the component (2) is coated with a layer (5) of solder material, and the baseplate (1) is at least partly coated with a layer of metal (6, 6′, 6″). The component (2) is arranged above the baseplate (1), the metal layer and the layer (5) of solder material being a vertical distance apart and not in contact with one another. Heat energy is then supplied from the side of the baseplate (1) for melting solder material of the layer (5) of solder material on the side (4) of the component (2) until a drop forms, with the result that the drop (5′) of solder material fills the space between the component (2) and the baseplate (1) for mutual fastening.

Abstract: An automatic soldering installation includes a soldering head (10) which is composed of a connecting element (11), a soldering wire dispenser (12), focusing optics (13), and an actuator (24). The soldering head (10) is mounted on the arm of a robot (16) which allows to position it in such a manner that the soldering wire (14) is positioned in the area of a respective soldering point (19). The focusing optics (13) is connected to a laser (21) by an optical fiber (22) and operates to focus the free laser beam (15) on the soldering point (19). The actuator (24), which is controlled by a control system (25), allows to vary the distance between the focusing optics (13) and the soldering point (19) independently from the robot (16), and thus to vary the width of the laser beam (15) at the soldering point (19). A more uniform temperature distribution on soldering points (19) of different sizes is thus obtained.