Abstract: A module arrangement for power semiconductor devices, includes two or more heat spreading layers with a first surface and a second surface being arranged opposite to the first surface. At least two or more power semiconductor devices are arranged on the first surface of the heat spreading layer and electrically connected thereto. An electrical isolation stack comprising an electrically insulating layer and electrically conductive layers is arranged in contact with the second surface of each heat spreading layer. The at least two or more power semiconductor devices, the heat spreading layers and a substantial part of each of the electrical isolation stacks are sealed from their surrounding environment by a molded enclosure. Accordingly, similar or better thermal characteristic of the module can be achieved instead of utilizing high cost electrically insulating layers, and double side cooling configurations can be easily implemented, without the use of a thick baseplate.

Abstract: A hybrid switch for a power converter and a method of operating said hybrid switch, the hybrid switch comprising: at a minimum a first and a second element comprising one or more switching devices of a first semiconductor type, and at a minimum a third element comprising one or more switching devices of a second semiconductor type, wherein the second semiconductor type is different from the first semiconductor type, and wherein each element is independently configurable and connected to a separate respective control terminal; and, a controller connected to the control terminals, wherein the controller is configured to control each element independently through each respective control terminal, and wherein the controller is further configured to activate elements based on a measured or estimated current and/or power as required by an operating condition of the converter.