Abstract: A machine and method for subdividing into individual substrates a wafer which is prescored with a pattern of intersecting score lines defining the substrates. The wafer is progressively directed over a first wafer-engaging surface substantially paralleling one set of score lines, and this surface operates during a breaking operation to impart a localized force at a score line in the set. The wafer is halted for the breaking operation, after which the broken-off portion is directed over a second wafer-engaging surface substantially paralleling the other set of score lines. This second surface operates, during a substrate breaking operation, to apply a localized force adjacent a score line of the other set. The broken-off portion is also halted for this second breaking operation, in which an individual substrate is separated from the previously broken-off portion of the wafer. An inclined track transports the material from the first to the second breaking operation.

Abstract: A machine and method for subdividing into individual substrates a wafer which is prescored with a pattern of intersecting score lines defining the substrates. The wafer is progressively directed over a first wafer-engaging surface substantially paralleling one set of score lines, and this surface cooperates during a breaking operation to impart a localized force at a score line in the set. The wafer is halted during the breaking operation, after which the broken-off portion is directed over a second wafer-engaging surface substantially paralleling the other set of score lines. This second surface cooperates, during a substrate breaking operation, to apply a localized force adjacent a score line of the other set. The broken-off portion is halted during this latter breaking operation at which a substrate is separated from the broken-off portion of the wafer.