Abstract: In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents a metal tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the structural integrity of the tape. The ablated metal becomes deposited to form circuit structures on a target structure.

Abstract: In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the tape substrate. The ablated metal becomes deposited to form circuit structures on a target structure.

Abstract: In one embodiment the present invention includes a direct-write laser lithography system. The system includes a reel-to-reel feed system that presents the clear film-side of a single-sided metal-clad tape to a laser for direct patterning of the metal. The laser beam is swept laterally across the tape by a moving mirror, and is intense enough to ablate the metal but not so strong as to destroy the tape substrate. In another instance, two specialized lasers are used, one tuned to ablate large field areas, and the other tuned to scribe fine features and lines. The ablated metal blows off in a downward direction and is collected for recycling.