Abstract: A security inlay having optically recognizable characters for an identity document comprises a first transparent layer and a second transparent layer. The first and second transparent layers are connected to one another. A first portion of the optically recognizable characters is formed by blackened sections in at least one of the layers. A second portion of the optically recognizable characters is formed by the color coating. The first and second portions are arranged and configured to reflect visible light. Infrared light is reflected by the first portion of the optical characters. During irradiation with visible light, the security inlay thus shows first graphical information formed jointly by the first portion of the optically recognizable characters and the second portion of the optically recognizable characters. Under irradiation with infrared light, the security inlay shows second graphical information formed by the first portion of the optical characters.

Abstract: The invention relates to a method and a device for transporting an arrangement of flexible circuit substrates produced on a transport substrate during the production of a laminate from the arranged circuit substrates, as well as—building thereon—a method and a device for producing a laminate of flexible circuit substrates. In the method, a film is applied to the arranged circuit substrates on the side thereof opposite the transport substrate, with the result that the film comes to lie over the transport substrate in at least two sections that are separate from each other and are not covered by a circuit substrate, and runs between them continuously over at least one of the circuit substrates.

Abstract: An optical examination device is designed to detect properties of a semiconductor component. The device comprises a first illumination arrangement, a second illumination arrangement and an imaging device, where the first illumination arrangement emits infrared light onto a first surface of the semiconductor component, which faces away from the imaging device (camera). The infrared light fully penetrates the semiconductor component at least proportionally. The second illumination arrangement emits visible light onto a second surface of the semiconductor component, which faces the imaging device. The imaging device is designed and arranged to detect the light spectrum emitted from both the first and the second illumination arrangement, and as a result of a subsequent image evaluation on the basis of both the visible and the infrared light spectrum, to provide a separate image reduction for determining property defects or damage of the semiconductor component.

Abstract: The device and method according to the invention are used to transfer an electronic ferromagnetic component from a carrier to a substrate using a magnetic assembly. The magnetic assembly is designed and arranged to aid in the correct positioning of the at least partly ferromagnetic electronic component on the substrate. The magnetic field generated by the magnetic assembly produces a magnetic force oriented from the carrier towards the substrate, said magnetic force aiding the transfer of the component from the carrier to the substrate such that a significantly increased positioning accuracy of the component is achieved compared to a transfer without said magnetic force.

Abstract: A method and an apparatus are provided for the equipping of an antenna structure, in particular an RFID antenna structure, with an electronic component, in particular with an RFID chip. The method includes: (a) applying an electronic component to an antenna structure which is formed on a carrier substrate and which is made from a sinterable material that is electrically conductive after its sintering, so that a contact surface is formed between a contact region of the antenna structure and a corresponding electrical contact of the component; and (b) heating the antenna structure in order to sinter the same, thereby causing formation of an adhesive-free mechanical and electrical connection between the contact region of the antenna structure and the electrical contact of the component. The method can also be used to equip the antenna structure with a plurality of electronic components.

Abstract: A method and a device for carrying out the method for transferring electronic components from a carrier substrate to a receiving substrate.

Abstract: A component-handling device for removing components from a structured component supply and for depositing the removed components at a receiving device. A first turning device having a plurality of receiving units receives a component from the structured component supply at a dispensing point, to turn the received component by a first predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a transfer point. A second turning device having a plurality of receiving units receives the component at the transfer point from a receiving unit of the first turning device, to turn the received component by a second predetermined angle about the longitudinal or transverse axis of the received component, and to convey the same to a depositing point. Position sensors detect position data of the turning devices, and position data of the components located on the receiving units.

Abstract: A polymer composite device comprises a first thermoplastic covering layer of a polymer material with a first softening temperature and a second thermoplastic covering layer of a polymer material with a second softening temperature. The polymer composite device also comprises a carrier layer, which is arranged between the first covering layer and the second covering layer. An inner layer, which comprises at least a first thermoplastic inner layer ply of a polymer material with a third softening temperature, is arranged between the first covering layer and the second covering layer. The inner layer at least partially surrounds the carrier layer in a material-bonding manner. The third softening temperature is lower than the first softening temperature and lower than the second softening temperature.

Abstract: A system for aligning an electronic component including a substrate having an aligning structure and an aligning device for aligning the electronic component with the aligning structure. The aligning structure defines a first and a second edge, which are at an angle relative to one another and are complementary to two sides of the electronic component to be aligned. The aligning device aligns the electronic component on the aligning structure by bringing sides of the electronic component into contact with both the first edge and also the second edge of the aligning structure. A dispensing unit dispensing the electronic component at a dispensing point by the device for aligning the electronic component close to the aligning structure. A receiving unit receives the electronic component aligned on the aligning structure in the device.

Abstract: A reception device for moving components along a first axis, a second axis and a third axis and that is designed to rotate in a controlled manner relative to a deposit point, at least partly about the third axis containing the deposit point, by means of a rotary drive and/or to be propelled in a controlled manner by means of at least one linear drive at least partly along one of the first, second or third axes, and/or to propel, in a controlled manner, a carrier guided by the reception device, along one of the first and/or second axes.

Abstract: A component-handling device for removing components from a structured component supply and for storing the removed components at a reception device, where the reception device is newly adjusted after being initially put into operation after the replacement of device components or after maintenance work, in order to comply with the precision requirements when handling the components. The component-handling device has a self-adjustment device which permits it to adjust the device efficiently in terms of time and with high precision without manual intervention by an operator. The self-adjustment device is composed of a multiplicity of optical sensors and a controller. Adaptation of the measurement results acquired by means of the optical sensors using position sensors and property sensors installed originally for component inspection during fabrication gives rise to a high degree of process reliability and at the same time permits device components to be inspected for damage.

Abstract: A flexible solar module strand manufactured by a method including providing a first conveyor track for applying flexible solar cells; guiding the first conveyor track around two or more deflecting means; providing individual flexible solar cells; applying the individual solar cells to the first conveyor track; deflecting the first conveyor track by guiding the first conveyor track over a first one of the deflecting means; separating the first conveyor track from the at least one deflected solar cell strip in such a manner that the solar cells are released, with their respective first or second sides facing the first conveyor track, from the first conveyor track; and applying the at least one deflected solar cell strip to a first film web in such a manner that the solar cells are oriented, with their respective first or second sides separated from the first conveyor track, away from the first film web.

Abstract: A device for transferring electronic components from a first carrier to a second carrier. A first receiving portion positions the first carrier on a support, wherein the electronic components are provided on a side of the first carrier, which faces away from the support. A second receiving portion positions the second carrier. The first receiving portion and the second receiving portion are arranged with respect to each other in such a manner that a gap separates the first carrier from the second carrier. A cap and/or the second receiving portion move from a first position into a second position to make the gap smaller. At least one slide lifts the first carrier, which is applied against the support, away from the support, and to move an electronic component provided on the first carrier, in the direction of the second carrier.

Abstract: A method and a device for sorting identification objects is described, wherein identification objects are fed in a defined sequence, one after the other, to a first transfer position and inspected for defects. Identification objects identified as defect-free are transferred in the first transfer position by a first transfer arrangement to a transfer buffer, and identification objects identified as defective are transported away by a first transport arrangement. The defect-free identification objects are then fed to a first magazine, which is then transported to a second transfer position by a second transport arrangement. The first magazine is then aligned in a first position with a first buffer of a rotatable sorting arrangement, and the defect-free identification objects following the defective identification objects are transported by the first transport arrangement to the second transfer position and transferred by a second transfer arrangement to the first buffer.

Abstract: A device for turning over identification objects comprising a receiving device for holding an identification object, wherein the receiving device can be moved from an initial position along a guide, and a first rolling element, which is rotatably received in the receiving device, wherein the first rolling element comprises a blocking device, which permits rotation of the receiving device in a first direction. The first rolling element, during movement along the first bearing, performs a rotation in the first direction and the receiving device performs a rotation in the first direction via the first rolling element. During an opposite movement of the receiving device, the first rolling element performs a rotation in a second direction opposite to the first direction, wherein the blocking device prevents rotation of the receiving device.

Abstract: An apparatus and a method for positioning electronic components to be transferred in relation to a discharging device. The discharging device includes a slide for at least one electronic component and a housing surrounding the slide. The electronic components are provided by a first carrier, which comprises a first side facing the discharging device and a second side facing away from the discharging device. An image data acquisition device captures image data of a region in which the slide is set up. A control determines positional data of the electronic component to be transferred and for generating control commands from the positional data. An actuator moves the first carrier and the discharging device in relation to each other in response to the control commands to change an offset between a longitudinal axis of the slide and a center axis of the electronic component.

Abstract: The process for producing tooth replacement parts is characterized in that curable tooth replacement material is introduced into a first mold of part of the human dentition, a positive model produced from a second mold is pressed into this material and the tooth replacement material remaining after the pressing-in is allowed to cure to form the tooth replacement part(s).

Abstract: A subject-matter of the invention is an impression material with at least one compound with at least two alkenyl groups as component (a), at least one compound with at least one chelating group as component (b), at least one organohydropolysiloxane as component (c), at least one hydrosilylation catalyst as component (d) and at least one compound with a chelatable metal atom as component (e), the chelating group of the component (b) exhibiting no reactive groups which can react with the component (c) and/or the component (d). The invention achieves a long storage stability.

Abstract: The invention relates to a polymerizable material for the production of a dental material for building up stumps, having the following characteristics: —the material comprises at least one polymerizable monomer, oligomer, and/or pre-polymer, —the total filler content of the material is 50 to 85% by weight, —the material comprises 5 to 25% by weight nano-filler, having a mean particle size d5o of 300 nm or less, wherein at least 50% by weight of said nano-filler has a particle size of 200 nm or less, —the material comprises 35 to 75% by weight micro-filler, having a mean particle size d50 of 0.3 to 10 ?m, —the ability to grind the cured material for building up stumps deviates from the ability to grind human dentin by 15% at the most. The invention further relates to a kit comprising at least two components for the production of such a polymerizable material.

Abstract: The invention provides an infiltrant for dental application that comprises crosslinking monomers. In accordance with the invention the infiltrant has a penetration coefficient PC>50 cm/s, and comprises 0.05%-20% by weight of acid-group-containing monomers.