Abstract: A device for removing a framed wafer from a wafer tray is described. The wafer tray including a wafer receptacle for receiving the framed wafer. The wafer receptacle being configured to hold the wafer perpendicular to the wafer plane and to remove it from the wafer tray in this manner. The wafer receptacle including at least one wafer receptacle edge contact element arranged and configured to abut against the front frame edge. The device including a drive and control device configured to guide the wafer receptacle along a predetermined path of movement into the access to the wafer tray. Each wafer receptacle edge contact element is spring-mounted in the direction of the path of movement and the wafer receptacle is movable from a first position to a second position.

Abstract: A method and a device for improving the measurement accuracy in the nm range for optical systems are disclosed. The object is provided with a plurality of structures oriented in the X and Y-coordinate direction. The light beam coming from at least one light source defines an optical illumination path.