Abstract: The invention relates to wafer aligning device (1) and a corresponding method for aligning a wafer (2) into a specified rotational angular position (as), having a wafer table (20) with a table receiving area (30) for receiving the wafer (2) on a table receiving area plane (T) and having an aligning means (40) with an aligning receiving area (50) which is designed to align the wafer (2) into a specified rotational angular position. The aligning receiving area (50) is arranged in an aligning position (PA) above the table receiving area plane (T) of the wafer table (20) when receiving the wafer (2), and at least one of the aligning receiving area (50) and the table receiving area (30) is designed to place a wafer (2) received in the aligning receiving area (50) on the table receiving area (30) upon traversing the aligning receiving area (50) and the table receiving area plane (T) by means of a vertical movement relative to the other of the aligning receiving area (50) and the table receiving area (30).