Abstract: A thin film solar module including a first film web, a series of electrically conductive contact pads arranged at intervals on the first film web, where the contact pads each have a first and a second area, and a series of flexible thin film solar cells. The thin film solar cells each include a first side which at least partially forms a first electrically conductive pole, a second side, which at least partially forms a second electrically conductive pole, a photovoltaically active layer composition, and at least one electrical contact located on the layer composition, which contacts the first electrically conductive pole, wherein the electrical conductor extends past a side of the photovoltaically active layered composition.

Abstract: A device for inspecting and rotating electronic components, particularly flip chips, includes a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. Also a method for inspecting and rotating electronic components, particularly flip chips.

Abstract: The invention relates to a method for producing an insert leaf for a book-like document, in particular to a method for producing a data page for an identification document. In order to achieve a straightforward method for producing an insert leaf (11), it is proposed for at least one hinge film (17, 18) to be provided, right from the start, as a constituent part of an insert-leaf blank (19) and for that part (22) of the insert-leaf body which is not required to be separated off, in order to produce the hinge region (12).

Abstract: The invention concerns an RFID transponder device with at least one substrate and at least one RFID chip, with at least one electrically conductive first surface element, which is at a distance from the substrate and connected electrically to the substrate and/or the RFID chip by means of at least one electrically conductive first connecting element.

Abstract: The invention relates to an optical detection device for the detection of at least one surface (11a) of at least one component (11), the component (11) being capable of being transported from a first to a second workstation (2, 3) by means of a retaining element (15), and a camera instrument (18) being directed onto a first surface (11a) of the component (11), with at least one light-source (12) which transmits first light-beams (25, 26) in the short-wave range to the first surface (11a), with at least one second light-source (13a, 13b) which transmits second light-beams (29, 30) in the long-wave range to at least one second surface (11b, 11c) of the component (11) which is oriented differently in relation to the first surface (11a), and with the camera instrument which receives the first and second light-beams (27, 33, 34) reflected on the surfaces (11a-c) for the purpose of generating an image (37) of the surfaces.

Abstract: An apparatus and a method for arranging through-openings in a flexible, movable band, said through-openings being arranged in series in at least one row, wherein each through-opening is arranged in the bottom of one of a plurality of depressions for receiving electronic components, said depressions being arranged in series in at least one row, wherein a laser device with at least one laser beam is arranged so as to act on sides of bottoms of the depressions facing away from the depressions, wherein the laser device is designed in such a way that, by means of the at least one laser beam, the through-openings can be burned into a predefinable portion of the band at predefinable positions on the bottom sides, within a predefinable period of time.

Abstract: The invention concerns a method and a system for production of RFID smart labels or smart label inlays, in which a multiplicity or RFID straps (11) are connected in succession with a multiplicity of antennae (20), where in a first step the RFID straps (11) to be arranged on a strap substrate band (5a) are separated (8, 9) and mounted on a substrate band (1, 1a, 1b, 1c; 10, 10a-c) for the smart labels or smart label inlays to be produced, and in a subsequent second step the antennae (20) are mounted on the substrate band (1, 1a, 1b, 1c; 10, 10a-c) and on first connection surfaces (26) of the RFID straps (11) such that the connection surfaces (26) of each RFID strap (11) electrically contact second connection surfaces of the antennae (20) allocated to the RFID strap (11) or the first connection surfaces (26) are positioned for electrical contact and fixed on the second connection surfaces.

Abstract: A simple and universal technique for fabricating different antenna structures, in particular a multilayer antenna structure, on a substrate is disclosed. Before the antenna is actually fabricated or placed on the substrate, connecting surfaces for connecting an antenna conductor and/or a chip or a chip module as well as through-platings extending through the antenna substrate are prepared between the connecting surfaces.

Abstract: A thermode device for connecting and/or electrically contacting a plurality of first semiconductor components to at least one support element and/or to a plurality of second semiconductor components by heating an adhesive under the application of pressure. An example thermode device includes a basic body and a heating element which can be extended out of the basic body and which, under the application of pressure, acts on at least one of the first semiconductor components, wherein the basic body has on its underside a plurality of heating plates which are oriented vertically and are arranged next to one another. Each heating plate has on its end and underside a plurality of the extendable heating elements, to the underside of each of which there is assigned a first semiconductor component.

Abstract: The invention relates to a device for inspecting and rotating electronic components, particularly flip chips, comprising a component which is rotatably mounted at a position of rotation and which is used to rotate electric components. A first receiving element is fixed to the outer side of the component in order to receive a single electronic component of a carrier and to secure it during a rotational movement of the component. A second receiving element is arranged on the outer side of the component opposite the first receiving element in relation to the point of rotation such that when the component is rotated by 180° it respectively faces the carrier, and a through opening is arranged in the component between the receiving elements such that when the component is rotated by 90° or 270° the through opening faces the carrier. The invention relates to a method for inspecting and rotating electronic components, particularly flipchips.

Abstract: Modular processing system (1) for processing personalization elements, in particular chip cards, smart cards and/or magnetic strip cards, comprising a large number of processing modules, wherein the processing modules each comprise at least one first and at least one second sub-module (3-7; 12-20) and are arranged in a linear manner one behind the other in such a way that in each case the first sub-module (3-7) as the process module is arranged in a processing area (10) above a common table top plane (21) of a system base frame (2) and the second sub-module (12-20) as the electronics and process component module is arranged in a control and evaluation area (11) below the table top plane (21).

Abstract: The invention relates to a method for establishing an electrical and mechanical connection between chip contact surfaces of an RFID chip and contact surfaces arranged on a strip-like substrate, wherein the chip contact surfaces which have on their surfaces a plurality of thread-like hooks and/or thread-like eyes are hooked together, under the effect of pressure, with the associated contact surfaces which have on their surfaces a plurality of thread-like eyes and/or thread-like hooks. A transponder is shown.

Abstract: Transponder having a dipole antenna which transmits and receives an electromagnetic wave having a wavelength ? and an RFID chip. The dipole antenna has at least one two-part conductor section with a total length l=?/2 and the chip is arranged between and connected to the two equal-length parts of the conductor section. Each part is composed of a first region made of a first conductive material which faces towards the RFID chip and has a first length which is proportionately small with regard to the total length, and of a second region made of a second conductive material which faces away from the RFID chip and has a second length.

Abstract: The invention relates to a method for connecting a flat bridge module; for chip modules to a flat substrate having a flat antenna on its upper side, in order to form a multi-layer transponder, wherein the bridge module has electrically conductive connection surfaces, wherein, in order to form a mechanical connection, an electrically insulating adhesive is arranged as a layer between an underside of the bridge module on the one hand and parts of an upper side of the substrate and parts of an upper side of the antenna on the other hand and then, in order to form an electrical connection, an electrically conductive adhesive is applied to sections of the upper side of the antenna which protrude laterally with respect to the bridge module in such a way that the adhesive at least partially covers the edges of upper sides of the bridge module. A multi-layer transponder is shown.

Abstract: An apparatus and method for fitting at least one web that is driven continuously through the device with transponders, in addition to a method for printing said web. At least one unit (12, 13, 14) is integrated into the device (1) for the continuous transfer of individual transponders (10) or transponder parts (10a), which operate according to the radio frequency identification principle, from at least one continuous carrier belt (8) to the web (2). During the process, the running speed of the carrier belt (8) is adapted to the running speed of the web (2), the latter speed being predetermined by the printing process. A connection device (11, 11a, 11b, 11c) connects the transponders (10) or transponder parts (10a) to the web (2) in a predetermined section of the carrier belt (8) and the web (2), when the speeds have been synchronised.

Abstract: At least two components are brought to rest on each other at least in an assembly portion, with a carrier element contacting a first one of the two components at least in the assembly portion, and at least one projection passing through the components in the assembly portion in the direction towards the carrier element. The carrier element is planarly supported at least in the assembly portion against the passing-through movement of the projection, and the passing of the projection through the components. The opposed planar support of the carrier element effects a plastic deformation of the passed-through material of the components in the direction transversely to the passing-through movement of the projection by deforming the carrier element.

Abstract: The invention relates to a method of connecting micro-chip modules to antennas arranged on a first carrier tape for the manufacture of transponders. The method is characterised in that the micro-chips are packaged in a preceding bonding process to form a chip module with electrical terminals and are applied to a second carrier tape. The two carrier tapes are wound off a reel and brought one above the other, whereby the chip modules are removed from the second carrier tape and placed at a predetermined point on the first carrier tape. This method facilitates a continuous manufacturing process which is particularly economical and particularly fast.