Abstract: An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.
Type:
Grant
Filed:
February 10, 2011
Date of Patent:
February 11, 2014
Assignee:
Mulpin Research Laboratories, Ltd.
Inventors:
Rodney Austin Green, Kevin Craig Bellette, Perry Arthur Kelly