Patents Assigned to Multi-Fineline Electronix, Inc.
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Patent number: 9018532Abstract: A stretchable circuit assembly includes first and second printed circuit boards, discrete conductive wires or flexible circuits including ends connected to the first and second printed circuit boards, and a stretchable interconnect in which the discrete conductive wires or flexible circuits and a portion of the first and second printed circuit boards are embedded. Main surfaces of the flexible circuits are perpendicular or substantially perpendicular to main surfaces of the stretchable interconnect. A method of making a stretchable circuit assembly includes the steps of providing electrical interconnects, a first printed circuit board, and a second printed circuit board, shaping the electrical interconnects to have an oscillating configuration, and forming a stretchable interconnect such that the electrical interconnects, a portion of the first printed circuit board, and a portion of the second printed circuit board are embedded within the stretchable interconnect.Type: GrantFiled: June 9, 2011Date of Patent: April 28, 2015Assignee: Multi-Fineline Electronix, Inc.Inventors: Dale Wesselmann, Luis Chau, Chengkong Chris Wu
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Patent number: 8228027Abstract: A wireless transmission system having a transmitter and receiver is described. In one embodiment, the transmitter includes an electronically-controlled switch controlled by a first pulse width modulation control circuit, the switch configured to pull current through a first inductor when the switch is closed, the first pulse width modulation control circuit outputting a PWM output signal to control the switch. A first feedback signal obtained from a control input of the switch. A second feedback signal obtained from a terminal of the inductor, wherein a control feedback signal is computed, at least in part, as a difference between the first feedback signal and the second feedback signal is provided to the first pulse width modulation control circuit. In one embodiment, the receiver includes a second pulse with modulation controller, the second pulse width modulation controller controlling the receiver switch to deliver a desired power from the receiving coil to a load.Type: GrantFiled: October 13, 2009Date of Patent: July 24, 2012Assignee: Multi-Fineline Electronix, Inc.Inventor: Qiang Gao
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Publication number: 20100127814Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: December 16, 2009Publication date: May 27, 2010Applicant: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7696852Abstract: The present invention relates to transformer inductor devices and to the methods of construction for inductive components such as inductors, chokes, and transformers. Plural via holes 12 are formed through a ferromagnetic substrate 10. Primary 32 and secondary 34 conductors are placed through common vias to form a plurality of cell transformers have 1:1 turns ratio. Circuits connect these primary and secondary winding in parallel and serial combustion to provide a transformer having the desired turns ratio.Type: GrantFiled: August 29, 2007Date of Patent: April 13, 2010Assignee: Multi-Fineline Electronix, Inc.Inventor: Philip A. Harding
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Patent number: 7690110Abstract: A method for making plural plated through holes in a single circuit board via is provided. The method includes plating copper in the walls of said circuit board via to form a first plated through hole and applying a thin layer of first adhesive promotor to the surface of said plated via. The method further includes vacuum depositing an organic layer having a high dielectric strength unto said layer of first adhesive promoter and applying a second layer of adhesive promoter over said organic layer. The method even further includes plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.Type: GrantFiled: August 24, 2007Date of Patent: April 6, 2010Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Patent number: 7656263Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: September 18, 2008Date of Patent: February 2, 2010Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Patent number: 7645941Abstract: A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other of said plurality of electronic circuits comprising a polyimide support member supporting a plurality of etched copper traces on a first side of said polyimide support member and a copper layer on a second side of said polyimide support member; said polyimide support member flexible along at least one axis; said plurality of etched copper traces and said copper layer substantially as flexible as said polyimide support member; a silver based material, including, for example, silver ink or silver film, surrounding a portion of each of said plurality of copper traces along substantially the entire length of each of said plurality of copper traces; said silver based material in electrical communication with (i) said copper layer via discontinuities inType: GrantFiled: April 24, 2007Date of Patent: January 12, 2010Assignee: Multi-Fineline Electronix, Inc.Inventors: Dale J. Wesselman, Charles E. Tapscott
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Patent number: 7602272Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: August 24, 2007Date of Patent: October 13, 2009Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D Guerra, Ciprian Marcoci
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Patent number: 7477124Abstract: Slot core inductors and transformers and methods for manufacturing same including using large scale flex circuitry manufacturing methods and machinery for providing two mating halves of a transformer winding. One winding is inserted into the slot of a slot core and one winding is located proximate to the exterior wall of the slot core. These respective halves are joined together using solder pads or the like to form continues windings through the slot and around the slotted core.Type: GrantFiled: December 13, 2006Date of Patent: January 13, 2009Assignee: Multi-Fineline Electronix, Inc.Inventor: Philip A. Harding
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Patent number: 7436282Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: GrantFiled: July 6, 2007Date of Patent: October 14, 2008Assignee: Multi-Fineline Electronix, Inc.Inventors: Ronald W. Whittaker, Joe D. Guerra, Ciprian Marcoci
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Publication number: 20080202807Abstract: A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other of said plurality of electronic circuits comprising a polyimide support member supporting a plurality of etched copper traces on a first side of said polyimide support member and a copper layer on a second side of said polyimide support member; said polyimide support member flexible along at least one axis; said plurality of etched copper traces and said copper layer substantially as flexible as said polyimide support member; a silver based material, including, for example, silver ink or silver film, surrounding a portion of each of said plurality of copper traces along substantially the entire length of each of said plurality of copper traces; said silver based material in electrical communication with (i) said copper layer via discontinuities inType: ApplicationFiled: April 24, 2007Publication date: August 28, 2008Applicant: Multi-Fineline Electronix, Inc.Inventors: Dale J. Wesselman, Charles E. Tapscott
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Publication number: 20070290783Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.Type: ApplicationFiled: July 6, 2007Publication date: December 20, 2007Applicant: Multi-Fineline Electronix, Inc.Inventors: Ronald Whittaker, Joe Guerra, Ciprian Marcoci
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Patent number: 7277002Abstract: The present invention relates to transformer inductor devices and to the methods of construction for inductive components such as inductors, chokes, and transformers. Plural via holes 12 are formed through a ferromagnetic substrate 10. Primary 32 and secondary 34 conductors are placed through common vias to form a plurality of cell transformers have a 1:1 turns ratio. Circuits connect these primary and secondary winding in parallel and serial combustion to provide a transformer having the desired turns ratio.Type: GrantFiled: September 15, 2003Date of Patent: October 2, 2007Assignee: Multi-Fineline Electronix, inc.Inventor: Philip A. Harding
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Patent number: 7178220Abstract: Methods for manufacturing slot core inductors and transformers includes using large scale flex circuitry manufacturing methods and machinery for providing two mating halves of a transformer winding. One winding is inserted into the slot of a slot core and one winding is located proximate to the exterior wall of the slot core. These respective halves are joined together using solder pads or the like to form continuous windings through the slot and around the slotted core.Type: GrantFiled: September 27, 2004Date of Patent: February 20, 2007Assignee: Multi-Fineline Electronix, Inc.Inventor: Philip A. Harding
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Patent number: 7135952Abstract: The present invention relates to transformer 1 inductor devices and to the methods of construction for inductive components such as inductors, chokes, and transformers. Plural via holes are formed through a ferromagnetic substrate. Primary and secondary conductors are placed through common vias to form a plurality of cell transformers have a 1:1 turns ratio. Circuits connect these primary and secondary winding in parallel and serial combustion to provide a transformer having the desired turns ratio.Type: GrantFiled: September 11, 2003Date of Patent: November 14, 2006Assignee: Multi-Fineline Electronix, Inc.Inventor: Philip A. Harding
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Patent number: 6820321Abstract: Methods of construction for inductive components such as inductors, chokes, and transformers enable these components to be fabricated using mass production techniques, thereby avoiding the need to handle discrete devices during the manufacturing process. In one preferred embodiment, holes are formed through a ferromagnetic substrate and plated with conductive material. The arrangement of these holes, and the subsequent design that ensues, will form the inductive components within the plane of the media in which the device is formed; using the substrate for a magnetic core. By using this approach, the inductive components can be miniaturized to physical sizes compatible with the requirements of modern surface mount technology (SMT) for integrated circuitry (IC). In another preferred embodiment, a series of thin, concentric high permeability rings are etched on a substrate to provide high permeability transformers and inductors having minimal eddy current effects.Type: GrantFiled: September 24, 2001Date of Patent: November 23, 2004Assignee: M-Flex Multi-Fineline Electronix, Inc.Inventor: Philip A. Harding
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Patent number: 6796017Abstract: Slot core inductors and transformers and methods for manufacturing same including using large scale flex circuitry manufacturing methods and machinery for providing two mating halves of a transformer winding. One winding is inserted into the slot of a slot core and one winding is located proximate to the exterior wall of the slot core. These respective halves are joined together using solder pads or the like to form continues windings through the slot and around the slotted core.Type: GrantFiled: May 8, 2003Date of Patent: September 28, 2004Assignee: M-Flex Multi-Fineline Electronix, Inc.Inventor: Philip A. Harding
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Patent number: 6674355Abstract: Slot core inductors and transformers and methods for manufacturing same including using large scale flex circuitry manufacturing methods and machinery for providing two mating halves of a transformer winding. One winding is inserted into the slot of a slot core and one winding is located proximate to the exterior wall of the slot core. These respective halves are joined together using solder pads or the like to form continuous windings through the slot and around the slotted core.Type: GrantFiled: May 21, 2001Date of Patent: January 6, 2004Assignee: M-Flex Multi-Fineline Electronix, Inc.Inventor: Philip A. Harding