Abstract: To provide a printed wiring board and a method for manufacturing the printed wiring board in which circuit widths of a signal transmission circuit and a power supply circuit or the like, which conventionally require to have greatly different circuit widths, are close to each other as much as possible and substantial miniaturization can be achieved. In order to achieve this object, a printed wiring board obtained by etching a metal-clad laminate including a conductive layer and an insulating layer is employed, in which a first circuit and a second circuit having different thicknesses formed in a same reference plane coexist. In addition, it is characterized in that a thicker circuit of the first circuit or the second circuit has a clad-like configuration in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked.

Abstract: The present invention provides a manufacturing method of a printed wiring board including a potting dam of favorable shape and positional accuracy. The method includes a process A of preparing a substrate comprising a wiring pattern, a process B of providing a resin layer on a surface of the substrate comprising the wiring pattern, a process C of fluidizing the resin layer by heating and deforming the resin layer to obtain a potting dam shape using a press plate comprising a mold shape, and a process D of removing the press plate comprising a mold shape to expose the resin layer comprising a portion with the deformed potting dam shape. When required, a process E of removing unnecessary portions of the resin layer deformed to obtain the potting dam shape can be added after the process D.

Abstract: A packaging method which makes possible firm connection of electronic components having bump areas and a wiring board having a pad electrode portion with secure electrical conduction is to be provided. To achieve this object, according to the packaging method which makes possible firm connection of electronic components having bump areas and a wiring board having a pad electrode portion with secure electrical conduction, the surface of the pad electrode portion of the wiring board has a roughened surface of 0.1 ?m (Rzjis) or more, a layer of thermosetting adhesive resin in a semi-cured stage is provided over the roughened surface of the pad electrode portion, the bump areas of electronic components and the pad electrode portion of the wiring board are placed one over the other to be arranged opposite each other, and crimped under pressure and heating. The roughened surface of the pad electrode portion of the wiring board is obtained by etching the pad electrodes or otherwise.