Patents Assigned to Multidyne Electronics Inc.
  • Patent number: 10469175
    Abstract: An apparatus includes a first transmitter/receiver module having a housing defining a longitudinal axis and with opposed first and second longitudinal sides extending along the longitudinal axis. The housing includes a first interlocking structure disposed along the first longitudinal side and having a first power interface, a second interlocking structure disposed along the second longitudinal side and having a second power interface, and first and second signal connectors positioned at respective first and second ends of the housing. The first transmitter/receiver module is configured to assume a mated condition in stacked coupled relation with one or more additional transmitter/receiver modules through cooperative engagement of at least one of the first and second interlocking structures of the first transmitter/receiver module with corresponding complementary interlocking structure arranged on a longitudinal side of a housing of one of the additional transmitter/receiver modules.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: November 5, 2019
    Assignee: Multidyne Electronics, Inc.
    Inventors: Francis P. Jachetta, Jesse Lloyd Maxwell Kent, Eugene Evan Baker
  • Patent number: 10211926
    Abstract: An apparatus in one embodiment comprises a first stackable transmitter/receiver module. The first stackable transmitter/receiver module comprises a housing having first and second ends and multiple sides between the first and second ends, a first signal connector arranged at the first end of the housing, a second signal connector arranged at the second end of the housing, and one or more sets of interconnects arranged on respective ones of the sides of the housing. The first stackable transmitter/receiver module is configured for mated stacking with one or more additional stackable transmitter/receiver modules via the one or more sets of interconnects. A given one of the sets of interconnects of the first transmitter/receiver module is configured to mate with a corresponding complementary set of interconnects arranged on a side of a housing of one of the additional stackable transmitter/receiver modules when the first and additional modules are stacked.
    Type: Grant
    Filed: May 1, 2018
    Date of Patent: February 19, 2019
    Assignee: Multidyne Electronics, Inc.
    Inventor: Francis P. Jachetta
  • Patent number: 9991962
    Abstract: An apparatus in one embodiment comprises a first stackable transmitter/receiver module. The first stackable transmitter/receiver module comprises a housing having first and second ends and multiple sides between the first and second ends, a first signal connector arranged at the first end of the housing, a second signal connector arranged at the second end of the housing, and one or more sets of interconnects arranged on respective ones of the sides of the housing. The first stackable transmitter/receiver module is configured for mated stacking with one or more additional stackable transmitter/receiver modules via the one or more sets of interconnects. A given one of the sets of interconnects of the first transmitter/receiver module is configured to mate with a corresponding complementary set of interconnects arranged on a side of a housing of one of the additional stackable transmitter/receiver modules when the first and additional modules are stacked.
    Type: Grant
    Filed: April 14, 2017
    Date of Patent: June 5, 2018
    Assignee: Multidyne Electronics, Inc.
    Inventor: Francis P. Jachetta
  • Patent number: 7920789
    Abstract: A system for communication of signals between remote devices and monitoring and control devices via fiber. The system in accordance with one aspect of the invention includes a plurality of remote interface units each coupled to a corresponding one of the remote devices, a base unit coupled to one or more monitoring devices and one or more control devices, and a central hub coupled between the base unit and the plurality of remote interface units. The central hub is coupled to the base unit by a first fiber optic link, and is coupled to the remote interface units by additional fiber optic links.
    Type: Grant
    Filed: January 5, 2009
    Date of Patent: April 5, 2011
    Assignee: Multidyne Electronics Inc.
    Inventors: Vincent Jachetta, Brian C. Moore, James G. Jachetta, Francis P. Jachetta
  • Patent number: 7822344
    Abstract: A system for communication of signals between remote devices and monitoring and control devices via fiber. The system in accordance with one aspect of the invention includes a plurality of remote interface units each coupled to a corresponding one of the remote devices, and a base unit coupled to the one or more monitoring devices and the one or more control devices. The plurality of remote interface units and the base unit are interconnected by fiber optic links to form a ring. Each of the remote interface units supplies a video signal to the base unit for distribution to the one or more monitoring devices, and the base unit supplies control signals from the one or more control devices to the plurality of remote interface units.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: October 26, 2010
    Assignee: Multidyne Electronics Inc.
    Inventors: Vincent Jachetta, Brian C. Moore, James G. Jachetta, Francis P. Jachetta
  • Patent number: 7474852
    Abstract: A system for communication of signals between remote devices and monitoring and control devices via fiber. The system in accordance with one aspect of the invention includes a plurality of remote interface units each coupled to a corresponding one of the remote devices, a base unit coupled to one or more monitoring devices and one or more control devices, and a central hub coupled between the base unit and the plurality of remote interface units. The central hub is coupled to the base unit by a first fiber optic link, and is coupled to the remote interface units by additional fiber optic links.
    Type: Grant
    Filed: February 11, 2005
    Date of Patent: January 6, 2009
    Assignee: Multidyne Electronics Inc.
    Inventors: Vincent Jachetta, Brian C. Moore, James G. Jachetta, Francis P. Jachetta