Patents Assigned to Multiprobe, Inc.
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Publication number: 20160216314Abstract: Current Voltage and Capacitance Voltage (IV and CV) measurements are critical in measurement of properties of electronic materials especially semiconductors. A semiconductor testing device to accomplish IV and CV measurement supports a semiconductor wafer and provides a probe for contacting a surface on the wafer under control of an atomic Force Microscope or similar probing device for positioning the probe to a desired measurement point on the wafer surface. Detection of contact by the probe on the surface is accomplished and test voltage is supplied to the semiconductor wafer. A first circuit for measuring capacitance sensed by the probe based on the test voltage and a complimentary circuit for measuring Fowler Nordheim current sensed by the probe based on the test voltage are employed with the probe allowing the calculation of characteristics of the semiconductor wafer based on the measured capacitance and Fowler Nordheim current.Type: ApplicationFiled: February 16, 2012Publication date: July 28, 2016Applicant: MULTIPROBE, INC.Inventor: Andrew N. Erickson
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Patent number: 8800998Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.Type: GrantFiled: December 30, 2011Date of Patent: August 12, 2014Assignee: Multiprobe, Inc.Inventors: Andrew N. Erickson, Jeffrey M. Markakis, Anton L. Riley
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Publication number: 20130168929Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.Type: ApplicationFiled: December 30, 2011Publication date: July 4, 2013Applicant: MULTIPROBE, INC.Inventors: Andrew N. Erickson, Jeffrey M. Markakis, Anton Riley
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Publication number: 20120146669Abstract: Current Voltage and Capacitance Voltage (IV and CV) measurements are critical in measurement of properties of electronic materials especially semiconductors. A semiconductor testing device to accomplish IV and CV measurement supports a semiconductor wafer and provides a probe for contacting a surface on the wafer under control of an atomic Force Microscope or similar probing device for positioning the probe to a desired measurement point on the wafer surface. Detection of contact by the probe on the surface is accomplished and test voltage is supplied to the semiconductor wafer. A first circuit for measuring capacitance sensed by the probe based on the test voltage and a complimentary circuit for measuring Fowler Nordheim current sensed by the probe based on the test voltage are employed with the probe allowing the calculation of characteristics of the semiconductor wafer based on the measured capacitance and Fowler Nordheim current.Type: ApplicationFiled: February 16, 2012Publication date: June 14, 2012Applicant: MULTIPROBE, INC.Inventor: Andrew N. Erickson
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Publication number: 20100148813Abstract: Current Voltage and Capacitance Voltage (IV and CV) measurements are critical in measurement of properties of electronic materials especially semiconductors. A semiconductor testing device to accomplish IV and CV measurement supports a semiconductor wafer and provides a probe for contacting a surface on the wafer under control of an atomic Force Microscope or similar probing device for positioning the probe to a desired measurement point on the wafer surface. Detection of contact by the probe on the surface is accomplished and test voltage is supplied to the semiconductor wafer. A first circuit for measuring capacitance sensed by the probe based on the test voltage and a complimentary circuit for measuring Fowler Nordheim current sensed by the probe based on the test voltage are employed with the probe allowing the calculation of characteristics of the semiconductor wafer based on the measured capacitance and Fowler Nordheim current.Type: ApplicationFiled: July 18, 2007Publication date: June 17, 2010Applicant: MULTIPROBE, INC.Inventor: Andrew N. Erickson
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Patent number: 7444857Abstract: A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.Type: GrantFiled: September 29, 2005Date of Patent: November 4, 2008Assignee: Multiprobe, Inc.Inventors: Casey Patrick Hare, Andrew Norman Erickson
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Patent number: 7415868Abstract: The present invention comprises an apparatus and a method for using multiple scanning probes to deconvolve tip artifacts in scanning probe microscopes and other scanning probe systems. The invention uses multiple scanning probe tips of different geometries or orientations to scan a feature, such as a semiconductor line or trench, and to display the scan data such that tip artifacts from each tip can be omitted from the measurement by data from the other tips.Type: GrantFiled: March 20, 2006Date of Patent: August 26, 2008Assignee: Multiprobe, Inc.Inventors: Casey Patrick Hare, Andrew Norman Erickson
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Patent number: 6951130Abstract: A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.Type: GrantFiled: December 17, 2004Date of Patent: October 4, 2005Assignee: Multiprobe, Inc.Inventors: Casey Patrick Hare, Andrew Norman Erickson
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Patent number: 6880389Abstract: A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.Type: GrantFiled: July 7, 2003Date of Patent: April 19, 2005Assignee: Multiprobe, Inc.Inventors: Casey Patrick Hare, Andrew Norman Erickson