Abstract: A semiconductor wafer processing tool has a support structure for a coarse motion positioning system. A measurement head having a rigid super structure is supported from the support structure by vibration isolators and a top plate is mounted to the super structure. A vacuum transfer chuck is releasably carried by the coarse motion positioning system and releasably adherable to the top plate by application of vacuum. The vacuum transfer chuck supports a semiconductor wafer.
Type:
Grant
Filed:
December 30, 2011
Date of Patent:
August 12, 2014
Assignee:
Multiprobe, Inc.
Inventors:
Andrew N. Erickson, Jeffrey M. Markakis, Anton L. Riley
Abstract: A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.
Type:
Grant
Filed:
September 29, 2005
Date of Patent:
November 4, 2008
Assignee:
Multiprobe, Inc.
Inventors:
Casey Patrick Hare, Andrew Norman Erickson
Abstract: The present invention comprises an apparatus and a method for using multiple scanning probes to deconvolve tip artifacts in scanning probe microscopes and other scanning probe systems. The invention uses multiple scanning probe tips of different geometries or orientations to scan a feature, such as a semiconductor line or trench, and to display the scan data such that tip artifacts from each tip can be omitted from the measurement by data from the other tips.
Type:
Grant
Filed:
March 20, 2006
Date of Patent:
August 26, 2008
Assignee:
Multiprobe, Inc.
Inventors:
Casey Patrick Hare, Andrew Norman Erickson
Abstract: A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.
Type:
Grant
Filed:
December 17, 2004
Date of Patent:
October 4, 2005
Assignee:
Multiprobe, Inc.
Inventors:
Casey Patrick Hare, Andrew Norman Erickson
Abstract: A method and apparatus for scanning multiple scanning probe microscopes in close proximity, to scan overlapping scan areas at the same time while avoiding collision employs a control system providing drive signals to a first Atomic Force Microscope (AFM) and calculated drive signals to additional AFMs based on the first drive signals and the relative position of the additional AFMs to the first AFM for consistent spaced motion. Scanning and Failure Analysis (FA) probing of multiple feature of interest using multiple APMs allows for reduced time for locating FA features to set up measurements.
Type:
Grant
Filed:
July 7, 2003
Date of Patent:
April 19, 2005
Assignee:
Multiprobe, Inc.
Inventors:
Casey Patrick Hare, Andrew Norman Erickson
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