Abstract: A radiation sensor array that exhibits improved fill factor is disclosed. The radiation sensor array incorporates sensors having support arms that are nested in vertical fashion with the support arms of neighboring sensors. This vertically-nested structure enables the radiation-sensing portions of the sensors to be more closely-packed.

Abstract: A radiation sensor array that exhibits improved performance is disclosed. The radiation sensor array dissipates kinetic energy within a capacitive sensing element and establishes an electric field across a two capacitor bridge circuit that comprises the capacitive sensing element, wherein the electric field has substantially constant magnitude during both sensing and reset modes of operation. The electric field, however, has opposite polarity during the sense and reset modes.

Abstract: A thermal sensor for low level radiation with built-in photo-thermal gain utilizing a thin film of pyro-optical material to modulate the reflectivity and/or transmission of a photonic carrier beam. The photonic carrier beam is modulated by the temperature of the pyro-optical film and detected by typically a silicon detector. A slight temperature increase of the pyro-optical film due to absorption of low level radiation increases the coefficient of absorption of the photonic carrier beam which in turn causes a further increase in temperature of the pyro-optical film. The photonic carrier beam provides power to increase the temperature of the pyro-optical film beyond the heating caused by the absorption of low level radiation alone. This thermal amplification effect provides a radiation sensor with photo-thermal gain.

Abstract: This invention is a micromachined sensor pixel structure that can be fabricated either as a discrete sensor or in array form with application to thermal sensing of radiation receive from various wavelength emitters. The transmissivity of a thermally-isolated microplatform is a sensitive function of temperature. This transmissivity is modulated by incident radiation from sources including infrared sources. The transmissivity of a micromachined structure is interrogated by means of an optical carrier. Readout is obtained by means of conventional silicon optical sensors or imagers. A multiplicity of micromachined pixels can be tailored for specific wavelengths permitting the array to operate as a multispectral imager with windows ranging from ultraviolet to millimeter wavelengths.