Abstract: A test device (400) for testing a mechanical pressure sensor (610) is described. The Device (400) comprises a mechanical pressure dummy (621), and an air chamber (320) having an elastic side section (222), wherein an increasing of air pressure in the air chamber (320) causes the elastic side section (222) to bulge and to press the mechanical pressure dummy (621) in a test position (D?).

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: A contact tip for a sequential test of electronic components comprises a base material and a hard material, wherein the base material and the hard material are fixed to each other and wherein the hard material has a thickness of at least 0.03 mm. The contact tip may be the contact tip of a contact element used for a sequential test of electronic components. A method of producing a contact tip of a contact element used for a sequential test of electronic components, comprises: Providing a plate made up of a base material and a hard material, wherein the base material and the hard material are fixed to each other; Cutting the plate along a cut line to form the contact tip wherein the cut line runs through the base material and the hard material and wherein the hard material has a thickness of at least 0.03 mm in a section where the cut line cuts the hard material.

Abstract: Embodiments of the invention is based on a device for testing electronic components with at least one test socket with test contacts, with a nest, in which at least one electronic component can be placed, and with at least one cleaning unit for the test contacts of the test socket, wherein by means of a relative movement, which can be carried out as a test stroke, between the test socket and nest the electronic component can be pressed against, and lifted from, the test contacts of the test socket. According to embodiments of the invention the at least one cleaning unit is designed in such a manner that during each test stroke the test contacts come into contact with the at least one cleaning unit.

Abstract: A contact spring for a testing base for high current testing of an electronic component, which is produced from a spring metal sheet of a predetermined thickness and possesses two identical opposing lateral faces, and which has a spring arm and a testing arm with a testing tip, where the testing arm forms an angle with the spring arm, which enables the testing tip to be positioned on a contact surface of the electronic component running approximately parallel to the spring arm, by relative movement between the testing base and the electronic component.

Abstract: Embodiments of the invention come up from a guide and support member within a device for testing electronic components, which guide and support member can be moved into a feeding position and into a testing position, the guide and support member with a base body for accommodating an electronic component to be tested, with at least one support for supporting contact springs of the electronic component to be tested, and with at least one stopper that stops the movement of the electronic component to be tested at one of its contact springs once the electronic component to be tested is in an exact position. According to the invention, the at least one support comprises a ceramic material, wherein the stopper is anchored in the base body.

Abstract: Embodiments of the invention are based on a method for positioning a carrier with a plurality of electronic components in a device for testing the electronic components, wherein the carrier is provided with a pick-and-place unit. According to embodiments of the invention several markings at one side of the carrier are detected with at least one camera and the position of the markings is determined in relation to the known position of a nest for receiving the carrier, the nest is moved into a position exactly opposite to the carrier, the carrier is handed over to the nest, several further markings at the other side of the carrier are detected by at least one further camera and the position of the further markings is determined in relation to the determined position of a test socket, the nest is positioned in a position exactly opposite to the test socket and the carrier is pressed against the test socket.

Abstract: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

Abstract: An apparatus for testing electronic devices, having a test head coupled to at least one immovably mounted test socket, a positioning device for positioning the electronic device in testing position and a lead-backer attached to the positioning device for supporting the electronic device and pressing it against the test socket. A supply port for supplying a temperature control medium to a temperature control system of the said lead-backer is immovably mounted beside the said test socket, the said temperature control system of the said lead-backer and the said supply port communicate with each other when the electronic device is in testing position, whereby the said temperature control medium flows from the said supply port to the said temperature control system of the said lead-backer.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the first abutting section being mounted via an elastic unit, the first abutting section and the second abutting section delimit an electronic component receiving volume in which the electronic component is to be received in the receptacle, the elastic unit extends below a bottom side of the electronic component receiving volume, and the elastic unit is adapted to provide a clamping force for clamping the electronic component between the first abutting section and the second abutting section.

Abstract: A method for testing and calibrating electronic semiconductor components which convert sound into electrical signals acoustically irradiates the components in a sound chamber whose largest free length is less than half the wavelength of the highest frequency of the sound waves produced during the test.

Abstract: An apparatus for testing electronic devices, having a test head coupled to at least one immovably mounted test socket, a positioning device for positioning the electronic device in testing position and a lead-backer attached to the positioning device for supporting the electronic device and pressing it against the test socket. A supply port for supplying a temperature control medium to a temperature control system of the said lead-backer is immovably mounted beside the said test socket, the said temperature control system of the said lead-backer and the said supply port communicate with each other when the electronic device is in testing position, whereby the said temperature control medium flows from the said supply port to the said temperature control system of the said lead-backer.

Abstract: A method of post-processing a plurality of electronic components in a post-processing machine after fabrication of the electronic components including providing a carrier with align fixtures, which align fixtures have a clamping mechanism, actuating the clamping mechanism to enlarge a size of receptacles, each of the receptacles is assigned to one of the align fixtures and the enlarged receptacles are larger than the electronic components to be received, positioning the electronic components in the receptacles of the align fixtures, actuating the clamping mechanism to reduce a size of the receptacles so that the electronic components are aligned within the receptacles of the carrier, placing the carrier in the post processing machine, and subjecting the electronic components to operations of the post-processing machine while the electronic components maintain in aligned positions in the receptacles of the carrier.

Abstract: An align fixture for aligning an electronic component having a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, the align fixture further having a first elastic unit and a second elastic unit, the first abutting section is flexibly mounted via the first elastic unit, and the second abutting section is flexibly mounted via the second elastic unit, and the first abutting section and the second abutting section are together adapted to floatingly engage the electronic component.

Abstract: A handler for electronic components, in particular IC's, comprising a feed unit for plungers with a pneumatic cylinder unit that can be displaced and that is coupled to a pneumatic cylinder displacement unit, which moves said cylinder unit back and forth in the axial direction of the plungers.

Abstract: An align fixture for aligning an electronic component having an elastic unit plate having an elastic unit receiving section, a receptacle adapted to receive the electronic component and having a first abutting section and a second abutting section, and an elastic unit, the first abutting section being flexibly mounted via the elastic unit, the elastic unit is adapted to exert a force to align the electronic component to the second abutting section, and the elastic unit is a separate elastic member adapted to be mounted at the elastic unit receiving section.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: In a device and a method for aligning and holding a plurality of singulated semi-conductor components in receiving pockets of a terminal carrier that are separated from each other, the terminal carrier has spring elements, which are part of a spring plate. The spring plate has a plurality of recesses disposed next to each other for forming a corresponding plurality of receiving pockets for the semi-conductor components, wherein the spring elements are formed from the spring plate in one piece.

Abstract: The invention relates to a plunger that is used to feed and withdraw an electronic component, in particular integrated circuits, to and/or from a contact device that is connected to a test device. The plunger head can be secured to a base body by a quick locking system. The quick locking system can be placed in a rear-engagement position when the plunger head is rotated in relation to the base body, a position in which the plunger head is axially coupled to the base body.

Abstract: A closure mechanism for pressure test chambers for testing electronic components, in particular ICs, has a plurality of pivoting jaws. At least some of the pivoting jaws have at least one lifting apparatus which can be advanced to two interacting cavity elements, which surround a cavity, by means of the pivoting jaws. Furthermore, at least some of the pivoting jaws have at least one locking device in order to move spacer elements into an intermediate space between the associated pivoting jaws and the compressed cavity element, as a result of which the tightness of the cavity is maintained even when the lifting apparatuses are retracted.