Abstract: An electrical interconnection board (e.g., a backplane) in which connection positions are spaced along one dimension of the board. Each connection position includes holes for making electrical connections. Layers of the board each have a pattern of conductive path segments connecting holes at each connection position with corresponding holes at other connection positions. The path segments together define continuous conductive routes along the length of the board. Each conductive route includes path segments which respectively lie on different layers. This arrangement increases the distance along which any two pairs of the conductive routes are adjacent each other on a layer, thus reducing interference (e.g., mutual coupling and crosstalk) and improving signal transmission characteristics.
Abstract: A multilayer panel board for mounting electronic components that have respectively different voltage requirements at specific leads of the components; in the board, conductive layers carry the different voltages across the board; terminals at locations across the board receive leads of the electronic components, some of these terminals being electrically connected directly to selected conductive layers at the locations to deliver corresponding voltages from the conductive layers to the specific leads; and the terminals are arranged in a pattern that permits at least one common region of the board to be occupied at a given time by any one of at least two different types of electronic components having respectively different voltage requirements, with the voltage requirements of the electronic component at the specific leads being served directly from the conductive layers via the terminals, whereby the common region need not be committed in advance to serve only one type of electronic component.
Abstract: A panel board has a first voltage layer sandwiched between two ground layers at a close spacing to produce a large distributed capacitance; the two ground layers are connected by plated-through conductive holes spaced regularly across the board; a second (exposed) voltage layer is connected by regularly spaced plated-through holes to the first voltage layer, increasing the current carrying capacity of, and reducing the resistance across, the board; the plated-through holes are arranged in rows and columns in a pattern permitting the mounting of decoupling capacitors, at any point on the board, in a position parallel to the rows or parallel to the columns; and a socket terminal can be electrically connected directly to the exposed voltage layer or to the exposed ground layer using a ring connector.
Abstract: An electronic programmable adapter for connecting an integrated circuit element having a pin array to an electrically dissimilar socket array. It features slideably mounted connector elements which can be selectively operated to be either disconnected or connected to their corresponding pin elements to make possible external electrical connections between adapter elements elsewhere in the array.