Patents Assigned to Mura Inc.
  • Patent number: 10502556
    Abstract: Certain embodiments are directed to 3D surface measurement systems and methods configured to direct engineered illumination of beams in one or more ray bundles to N illumination directions incident a sample surface. The systems and methods can measure a map of surface normals, a depth map, and a map of surface properties using intensity images captured while the engineered illumination is directed to the sample surface.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: December 10, 2019
    Assignee: Mura Inc.
    Inventors: Lingfei Meng, Jun Jiang