Abstract: A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

Abstract: A MEMS-sensor structure comprising first means and second means coupled for double differential detection and positioned symmetrically to provide quantities for the double differential detection in a phase shift. If the sensor deforms, due to a specifically symmetric positioning of the first and second means, the effect of the displacement is at least partly eliminated.

Abstract: A power collector structure connected to a base is repetitively deformed or bent. The power collector structure is bar-like, and is connected to the base in an essentially rigid manner. A power collector for converting mechanical energy to electric power is connected to the power collector structure.

Abstract: The invention relates to measuring devices to be used in physical measuring, and more particularly, to a method and a device for measuring the progress of a moving person. In the solution according to the invention the quantities describing the progress of the moving person are being calculated based on step cycle-specific acceleration stage characteristic accelerations a+ and step cycle-specific braking stage characteristic acceleration a? obtained from acceleration values measured by means of an acceleration sensor, and on the measured time. The invention aims at providing a solution, better and simpler than prior solutions, for measuring the progress of a moving person, which solution is applicable for use in a multitude of measuring solutions for ways of locomotion of various types.

Abstract: The invention shows a method to control a pointing device with an angular, rate sensor, that comprises generating an ensemble of orthogonal unit vector associated signals by at least one angular rate sensor to represent angular rates in a dimensional space for each mutually orthogonal unit vector direction of said dimensional space, amplifying the at least one of said signal non-linearly for determination of cursor on a screen for (x,y) coordinates of the screen, applying a decision criterion to determine the state of the pointing device as based on said unit vector associated signals. The invention also shows a pointer utilizing the method and a system comprising such a pointer.

Abstract: A MEMS structure comprises an anchor, a spring, and a seismic mass that is suspended to the anchor via the spring to pivot around an axis of rotation. Errors from unwanted vibration modes are reduced by including in the MEMS structure a spring structure that extends from the seismic mass to the anchor. Said spring structure comprises a side arm that is connected to the seismic mass or the anchor. At least part of the spring structure is formed by a side arm that extends in the spring structure in a direction parallel to the axis of rotation of the seismic mass; and is attached to one end of the spring.

Abstract: A MEMS-sensor structure comprising first means and second means coupled for double differential detection and positioned symmetrically to provide quantities for the double differential detection in a phase shift. If the sensor deforms, due to a specifically symmetric positioning of the first and second means, the effect of the displacement is at least partly eliminated.

Abstract: A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

Abstract: The invention presents a spring structure (501), which has at least two masses (Ma, Mb) coupled in a first direction as opposite phase oscillators by means of springs (Sh1, Sh2) connected to them (Ma, Mb), via a loop (L, E) between said springs (Sh1, Sh2) connected to their coupling points, wherein oblique springs (Sl45, Sr45) are connected from said coupling points of the loop (L) to the anchors (A) of the base such that the longitudinal motion of the loop (L) is arranged to occur perpendicularly or substantially perpendicularly to said first direction, to thus attenuate opposite phase oscillation other than that of the masses (Ma, Mb). The invention also presents the use of a spring structure in a resonator and/or in a resonator array as well as in a sensor or a sensor comprising system.

Abstract: A micro-mechanical resonator is provided. The micro-mechanical resonator comprises two masses coupled in the direction of a common axis by a spring structure. The spring structure comprises a spring that couples at least a first bar connected to the masses and a second bar extending in the motion axis direction, said spring being arranged to bend in a direction perpendicular to the motion direction of the motion axis. A micro-mechanical resonator matrix, a sensor and a navigation device are also provided.

Abstract: The invention relates to measuring devices used for measuring angular velocity, and more precisely, to vibrating micro-mechanical sensors of angular velocity. The sensor of angular velocity according to the invention comprises at least two seismic mass structures (1), (2), excitation structures (3), (4) and coupling seesaw type springs (6), (7). The objective of the invention is to provide an improved sensor structure, which enables reliable measuring with good efficiency particularly in small vibrating micro-mechanical angular velocity sensor solutions.

Abstract: A method for manufacturing microelectromechanical flexural resonators with a deforming element that has an elongate body extending along a spring axis. A deforming element is positioned on the semiconductor wafer with a defined nominal n-type doping concentration such that a crystal orientation angle is formed between the spring axis of the deforming element and a crystal axis of the silicon semiconductor wafer. The combination of the crystal orientation angle and the nominal n-type doping concentration is adjusted to a specific range, based on total frequency error of the deforming element in a broad temperature range. The combination is optimized to a range where also sensitivity to variations in the material properties is minimized.

Abstract: The invention embodies a harvester (12) to convert energy from mechanical domain to electrical domain. The harvester comprises at least one inertial body (6), at least one beam (7, 9), a support (8) to said at least one beam (7, 9) and transducer means (10, 16), wherein said at least one beam (7, 9) configures the inertial body (6) into a pendulum structure being suspended from said support (8) so that the beam (7, 9) is allowed to bend according to the kinetic state changes of the inertial body (6), and is configured to interact with at least one transducer means (10) that is/are configured to produce change in the electrical state of said transducer means (10, 16) responsively to the kinetic state of the beam (7, 9). The invention also shows harvester module, matrix and a harvester system comprising at least one embodied harvester. The invention also shows a tire and a foot wear that comprises at least one harvester embodied.

Abstract: A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

Abstract: The object of the invention is to provide an improved structure for a microelectromechanical (MEMS) resonator. According to a first aspect of the invention, the resonator structure in accordance with the invention has a characteristic frequency of oscillation in combination with a given mechanical amplitude, whereby to set said mechanical amplitude, in the resonator structure, by way anchoring at an anchor point located at a given point of the resonator structure substrate, a first element is adapted oscillatory and a second element is adapted oscillatory in such a manner that at least one of said first element and of said second element are arranged to oscillate synchronously with regard to said anchor point, whereby the location of said anchor point is selected to be substantially within the joint projection defined by the dimensions of said first and said second element.

Abstract: The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for sensors of angular velocity.

Abstract: The invention relates to measuring devices to be used in the measuring of angular velocity and, more precisely, to vibrating micromechanical sensors of angular velocity. In a sensor of angular velocity according to the invention, a mass is supported to the frame of the sensor component by means of an asymmetrical spring structure (1), (2), (3), (4), (22), (24) in such a way, that the coupling from one mode of motion to another, conveyed by the spring (1), (2), (3), (4), (22), (24), cancels or alleviates the coupling caused by the non-ideality due to the skewness in the springs or in their support. The structure of the sensor of angular velocity according to the invention enables reliable measuring with good performance, particularly in small vibrating micromechanical solutions for sensors of angular velocity.

Abstract: A power collector structure connected to a base is repetitively deformed or bent. The power collector structure is bar-like, and is connected to the base in an essentially rigid manner. A power collector for converting mechanical energy to electric power is connected to the power collector structure.

Abstract: A MEMS-sensor structure comprising first means and second means coupled for double differential detection and positioned symmetrically to provide quantities for the double differential detection in a phase shift. If the sensor deforms, due to a specifically symmetric positioning of the first and second means, the effect of the displacement is at least partly eliminated.

Abstract: A MEMS structure comprises an anchor, a spring, and a seismic mass that is suspended to the anchor via the spring to pivot around an axis of rotation. Errors from unwanted vibration modes are reduced by including in the MEMS structure a spring structure that extends from the seismic mass to the anchor. Said spring structure comprises a side arm that is connected to the seismic mass or the anchor. At least part of the spring structure is formed by a side arm that extends in the spring structure in a direction parallel to the axis of rotation of the seismic mass; and is attached to one end of the spring.