Abstract: A radio-frequency module includes a mount board, an electronic component, an external connection terminal, and an acoustic wave filter. The mount board has a first principal surface and a second principal surface facing each other. The electronic component is arranged on the first principal surface of the mount board. The external connection terminal is arranged on the second principal surface of the mount board. The acoustic wave filter is arranged on the second principal surface of the mount board. The acoustic wave filter is a bare-chip acoustic wave filter. The radio-frequency module is suppressed in height along a thickness of the mount board.

Abstract: A radio-frequency module includes a module substrate having a first major surface and a second major surface, a first receive filter configured to pass a receive signal in a first communication band, a second receive filter configured to pass a receive signal in a second communication band, an antenna switch configured to control connection between the first receive filter and an antenna connection terminal and also control connection between the second receive filter and the antenna connection terminal, and a matching circuit coupled between the antenna connection terminal and the first receive filter. The matching circuit includes matching switches and at least one of an inductor and a capacitor. The first receive filter and the second receive filter are disposed at the first major surface. The antenna switch and the matching switches are included in a single semiconductor integrated circuit disposed at the second major surface.