Abstract: Provided herein is a battery pack including a plurality of secondary batteries, a containing member, a protective member, and a wiring member. The plurality of secondary batteries include a plurality of terminals at each secondary battery. The containing member contains the plurality secondary batteries to expose the plurality of terminals. The protective member includes a plurality of openings, and the plurality of secondary batteries contained in the containing member are covered with the protective member to expose the plurality of terminals from the plurality of openings. The wiring member is coupled to the plurality of terminals exposed from the plurality of openings. One or both of the containing member and the protective member include one or both of a ceramic material and a polymer material having a heat resistance temperature of 300° C. or higher.

Abstract: A balun transformer includes an input terminal into which an unbalanced signal is input, a converter that includes at least a first signal line connected to the input terminal and that converts the unbalanced signal into a balanced signal, a first output terminal connected to the first signal line, a second output terminal from which the balanced signal is output, the balanced signal being also output from the first output terminal, and a capacitor connected between the input terminal and the second output terminal.

Abstract: A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.

Abstract: A camera module includes an image sensor IC, a resin multilayer board including thermoplastic resin layers stacked in a direction perpendicular or substantially perpendicular to a light receiving surface of the image sensor IC, a mounting electrode which is stacked on the thermoplastic resin layer and on which the image sensor IC is mounted, and a via-hole conductor electrically connected to the mounting electrode. The resin multilayer board includes a flat plate portion including a surface on which the mounting electrode is mounted, and a rigid portion including a greater number of thermoplastic resin layers than that of the flat plate portion, and the via-hole conductor is arranged in the flat plate portion so as to avoid the thermoplastic resin layer on which the mounting electrode is stacked.

Abstract: A boundary acoustic wave device includes a first medium layer made of a first dielectric material and a second medium layer made of a second dielectric material having an acoustic velocity different from the acoustic velocity of the first dielectric material. The first medium layer and the second medium layer are disposed on a piezoelectric substrate, and an IDT electrode is arranged along the interface between the piezoelectric substrate and the first medium layer. When the fast transverse bulk wave of the piezoelectric substrate has an acoustic velocity V1 and a higher-order mode boundary acoustic wave has an acoustic velocity Va at an anti-resonance point, the boundary acoustic wave device satisfies the relationship Va>V1.

Abstract: An antenna device capable of not only achieving multiple resonances and wideband characteristics but also achieving improvement of antenna efficiency and accurate matching at all resonant frequencies, and a wireless communication apparatus. In one example, an antenna device 1 includes a radiation electrode 2 to which power is capacitively fed through a capacitor portion C1, and additional radiation electrodes 3-1 to 3-3 branched from the radiation electrode 2. A distal end portion 2a of the radiation electrode 2 is grounded to a ground region 402, and is a portion at which a minimum voltage is obtained when power is fed. A capacitor portion C2 that is a portion at which a maximum voltage is obtained when power is fed is disposed in a proximal end portion 2b of the radiation electrode 2, and a variable capacitance element 4 which is grounded is connected in series with the capacitor portion C2.

Abstract: A signal processing circuit detects, at a plurality of different timing points, a first and a second distance of an oncoming vehicle approaching a vehicle including the radar apparatus and detects a first and a second component of a relative velocity of the vehicle in the radar-apparatus direction. A distance of closest approach of the oncoming vehicle to the vehicle appears when the vehicle and the oncoming vehicle pass each other side by side. The signal processing circuit computes the distance of closest approach on the basis of a formula indicating that a relative velocity given by the first distance, the distance of closest approach, and the first component of a relative velocity in the radar-apparatus direction is equal to a relative velocity given by the second distance, the distance of closest approach, and the second component of a relative velocity in the radar-apparatus direction.

Abstract: A work piece is mixed with Ni pieces having an average diameter of 1 mm and exhibiting catalytic activity to oxidation reaction of sodium phosphinate (NaH2PO2) added as a reducing agent in a plating bath containing the reducing agent and a Ni salt to form a Ni—P film on an electrode made of Cu, Ag or Ag—Pd by auto-catalytic electroless plating. Then, the work piece is dipped in a plating bath containing an Au salt to form an Au film on the surface of the Ni—P film by substitutional electroless plating. This method is capable of forming a desired plating film only on a desired portion at a low cost.

Abstract: A chip inductor has electrode layers, insulating layers disposed on the electrode layers, and an uppermost insulating layer all disposed on a ceramic board. An inorganic pigment such as a Co oxide or an Al oxide is added to the insulating layer at a concentration of from about 2% to about 20% by weight. Break grooves are formed in the form of a lattice on the insulating layer by a laser beam irradiation, and the board is divided along the grooves. By adding the inorganic pigment, the break grooves are effectively formed, and the mother board is divided accurately along the break grooves, such that a chip inductor having an increased L value and an increased Q value is produced.