Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the pair of multilayer body main surfaces in the vicinity of the board. The interposer board is an alumina board. The board end surfaces each include a metal layer including a Zn-containing layer and a Cu layer on an outer periphery of the Zn-containing layer.

Abstract: A power factor correction converter that outputs a DC output voltage from an AC input voltage, includes two channels each including a high-side switch and a low-side switch connected in cascade between a positive output terminal and a negative output terminal of the power factor correction converter and with a node between the high-side switch and the low-side switch; an inductor connected to a first terminal of the AC input voltage and the first node; a gate driver connected to the second high-side switch and the second low-side switch; a bootstrap circuit connected to the second node and the gate driver; wherein the second node is connected to a second terminal of the AC input voltage; and the bootstrap circuit is pre-charged at beginnings of negative half-cycles of the AC input voltage.

Abstract: A transmission line substrate includes a line portion and a connecting portion. The transmission line substrate includes a base material, a first ground conductor, a second ground conductor, a signal line, an external electrode, a second interlayer connection conductor. In the line portion, a transmission line having a strip line structure including the signal line, the first ground conductor, and the second ground conductor is provided. In the connecting portion, the signal line and the external electrode face each other in a stacking direction, without including therebetween an interlayer connection conductor. The second interlayer connection conductor surrounds a facing portion in which the signal line and the external electrode face each other in the Z-axis direction.

Abstract: An acoustic resonator includes a piezoelectric plate with a back surface attached to a substrate. An interdigital transducer (IDT) including interleaved fingers is formed on the front surface of the piezoelectric plate, the IDT comprising multiple copies of a unit cell juxtaposed along a length of the IDT. Each unit cell includes a first pitch/mark zone having a first pitch P1 between adjacent fingers and a first mark M1 and a second pitch/mark zone having a second pitch P2 and a second mark M2, where P2 is not equal to P1 and M2 is not equal to M1. A radio frequency signal applied to the IDT causes the first pitch mark zone and the second pitch/mark zone to excite a same shear primary acoustic mode in the piezoelectric plate.

Abstract: The present invention aims to provide an antimicrobial and antiviral agent which comprises a naturally occurring component as an active ingredient and is effective against microbes including various classes of fungi and viruses. In one aspect of the present invention, provided is an antimicrobial and antiviral agent comprising Lactobacillus derived from Artemisia indica var. maximowiczii.

Abstract: A nanomagnetic inductor core that includes: a porous, electrically-insulating template having high-permeability material in the pores thereof to constitute elongated nanowires, and wherein the elongated nanowires are segmented along their axial direction; and a segment of dielectric material interposed between adjacent segments of the high-permeability material along the axial direction of the nanowire; wherein each segment of the high-permeability material has a length, in the axial direction of the nanowire, no greater than a size of a single magnetic domain, and wherein a maximal cross-sectional dimension of the nanowire is no greater than the size of the single magnetic domain. Inductors and LC interposers using such nanomagnetic inductor cores, as well as associated fabrication methods.

Abstract: A vibration device that includes: a fixing part having a flat plate shape; a vibration part having a flat plate shape, the vibration part being disposed around the fixing part as viewed in a normal direction of the fixing part; a coupling part that couples the vibration part and the fixing part and is constructed to elastically deform, the vibration part constructed to be displaced in an orthogonal direction orthogonal to the normal direction of the fixing part with respect to the fixing part; and a vibration film fixed to the vibration part and the fixing part, the vibration film constructed to vibrate the vibration part in the orthogonal direction with respect to the fixing part when an electric signal is applied to the vibration film.

Abstract: A soft magnetic material for soft magnetic particles with a high filling rate. The soft magnetic material contains first soft magnetic particles and second soft magnetic particles with a larger average particle size than the first soft magnetic particles. The first soft magnetic particles have an average particle size in the range of 0.5 to 10 ?m, and the first soft magnetic particles have a nonpolar hydrocarbon group on their surfaces.

Abstract: A three-terminal capacitor includes a main body having a cylindrical or substantially cylindrical shape extending in a first direction and including first and second inner electrodes alternately laminated together with dielectric layers interposed therebetween, a pair of first outer electrodes on two end surfaces of the main body in the first direction and electrically connected to the first inner electrodes, and a second outer electrode electrically connected to the second inner electrodes. The main body includes a projecting portion projecting in a direction perpendicular or substantially perpendicular to the first direction at a position between the pair of first outer electrodes. The second outer electrode is provided on one surface of the projecting portion viewable when viewed in the first direction.

Abstract: A multilayer ceramic capacitor includes a multilayer body including dielectric layers and internal electrodes alternately stacked on one another, and two external electrodes respectively on two end surfaces of the multilayer body. Each of the dielectric layers includes, at a location coincident with an end portion of a respective one of the internal electrodes, a thick-walled portion thicker in a stacking direction than a portion corresponding in position to a middle portion of a main surface of the multilayer body. When viewed in the stacking direction, positions of some of the thick-walled portions of the dielectric layers are out of alignment with positions of a remainder of the thick-walled portions of the dielectric layers.

Abstract: An inductor component comprising a main body part including a magnetic layer containing a resin and a metal magnetic powder contained in the resin; an inductor wiring disposed in the main body part; an external terminal exposed from the main body part; and a lead-out wiring electrically connecting the inductor wiring and the external terminal. Also, an outer surface of the external terminal includes a concave part.

Abstract: An electronic component includes a substrate, a functional portion, external connection conductor portions, and first and second heat-conducting portions. The functional portion is located on first principal surface of the substrate and portion generates heat during operation. The external connection conductor portions are located directly on the first principal surface of the substrate or located below the first principal surface without direct contact with the substrate. The second principal surface of the substrate includes first and second regions. When viewed in plan in a thickness direction of the substrate, the first region does not overlap the functional portion, and the second region coincides with the functional portion. The first heat-conducting portion is located directly on all or a portion of the first region or located over all or a portion of the first region without direct contact with the substrate.

Abstract: A mesa portion is formed on a substrate. An insulating film including an organic layer is disposed on the mesa portion. A conductor film is disposed on the insulating film. A cavity provided in the organic layer has side surfaces extending in a first direction. A shorter distance out of distances in a second direction perpendicular to the first direction from the mesa portion to the side surfaces of the cavity in plan view is defined as a first distance. A shorter distance out of distances in the first direction from the mesa portion to side surfaces of the cavity in plan view is defined as a second distance. A height of a first step of the mesa portion is defined as a first height. At least one of the first distance and the second distance is greater than or equal to the first height.

Abstract: A circuit module comprises a substrate module, an electronic component, and a first conductive joining member. The substrate module includes a circuit substrate having an upper main surface and a lower main surface, an insulating member covering the upper main surface of the circuit substrate, an insulating member covering the upper main surface of the circuit substrate, and a first metal pin that passes through the insulating member parallel to a vertical axis and is electrically connected to the circuit substrate. The first metal pin has a first exposed portion. The first exposed portion is exposed from the insulating member to face a right direction. A first outer electrode has a left projecting portion projecting in a left direction from the left surface. A first conductive joining member joins the first exposed portion and the left projecting portion to each other.

Abstract: A multilayer coil component includes a multilayer body and outer electrodes. The multilayer body includes insulating layers and a coil. The insulating layers are stacked on top of one another in a stacking direction. The coil is embedded in the multilayer body. The outer electrodes are on an outer surface of the multilayer body and are electrically connected to the coil. The coil includes coil conductors, which are stacked together with the insulating layers in the stacking direction and electrically connected to each other. The coil includes a parallel section in which two or more of the coil conductors stacked in layers are electrically connected in parallel by via conductors interposed therebetween. The parallel section includes a first parallel section and a second parallel section, which is electrically connected in series with the first parallel section.

Abstract: A high frequency circuit includes a power amplifier and a matching circuit connected to an output terminal of the power amplifier. The matching circuit includes an inductor connected in series to an output transmission path of the power amplifier, a capacitor connected in series to and between one end of the inductor and the ground, an inductor connected in series to and between the capacitor and the ground, a switch having a common terminal, a selection terminal, and a selection terminal, a capacitor connected in series to and between the common terminal and the one end of the inductor. The selection terminal is connected to the ground, and the selection terminal is connected to the other end of the inductor.

Abstract: An antenna module has a substrate, a radiating element disposed in or on the substrate, a power feeding line, and a dielectric body. The substrate has a rectangular shape including first and second sides adjacent to each other. The power feeding line extends in a normal direction of the substrate and transfers radio frequency signals supplied from an RFIC to the radiating element. The dielectric body is disposed on a side surface of the substrate. The power feeding line is coupled to the radiating element at a position offset from the center of the radiating element in a first direction toward the first side. The dielectric body is disposed so as to cover the side surface of the substrate including the first side. The dielectric constant of the dielectric body is higher than the dielectric constant of the substrate.

Abstract: A coil component having improved magnetic characteristics. The coil component includes a body having a substantially hexahedral shape and including a winding portion formed by winding a conductive wire based on a winding axis and a magnetic body portion; and paired metal terminals having joint portions to which first and second ends of the conductive wire are electrically connected. Each of the paired metal terminals extends outside an outer surface of the body parallel to the winding axis. Of four quadrants separated from one another by imaginary coordinate axes that are orthogonal to one another with the center of the body as the origin in plan view in the winding axis direction, more than half the area of one of the joint portions is disposed in a quadrant not adjacent to the quadrant in which more than half the area of the other joint portion is disposed.

Abstract: A first receiving band and a first transmission band in band A and a second transmission band and a second receiving band in band B are listed in frequency order. A radio frequency module includes: first and second boards; a first filter having a passband that is the first transmission band; second and sixth filters each having a passband that is the first receiving band; third and fifth filters each having a passband that is the second receiving band; a first power amplifier connected to the first filter; a fourth filter having a passband that is the second transmission band; and a second power amplifier connected to the fourth filter. The first to third filters and the first power amplifier are disposed on the first board, and the fourth to sixth filters and the second power amplifier are disposed on the second board.

Abstract: A wireless power transmission system includes a structure surrounded as a whole by an electromagnetic wave-shielding member having an appropriate conductivity, at least one power transmission unit, and at least one power reception unit. A power reception unit includes a power receiver including a dielectric substrate, a rectifier circuit, and a power reception antenna. The power reception antenna includes power reception antenna lines in a same plane on the dielectric substrate. One ends of the power reception antenna lines are connected to the rectifier circuit, and other ends different from the one ends connected to the rectifier circuit are open ends. A planar shape of the dielectric substrate is a 2N-sided polygon with line symmetry (where N is an integer of two or more), and the power reception antenna lines are along N sides that are adjacent to and different from each other of the dielectric substrate.