Abstract: A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil includes a first coil conductor. The second coil includes a second coil conductor disposed along an interface between non-conductor layers different from an interface between non-conductor layers along which the first coil conductor is disposed. The first and second coil conductors each have a number of turns of less than 2.

Abstract: A semiconductor apparatus includes a substrate, plural transistor groups disposed on the substrate, an insulating film, and a metal member. Each of the plural transistor groups includes plural unit transistors arranged in a first direction within a plane of a top surface of the substrate. The plural transistor groups are arranged in a second direction perpendicular to the first direction. The insulating film covers the plural unit transistors and includes at least one cavity. The metal member is disposed on the insulating film and is electrically connected to the plural unit transistors via the at least one cavity. A heat transfer path is formed by a metal in a region from each of the plural unit transistors to a top surface of the metal member. Thermal resistance values of the heat transfer paths are different from each other among the plural unit transistors.

Abstract: A laser module includes a plurality of light emission regions and the plurality of light emission regions emit a plurality of laser beams. An optical waveguide and a lens condense the plurality of laser beams to an identical focal point. An adjustment mechanism is configured to adjust relative positional relation between the sample stage and a condenser lens (the optical waveguide and the lens). A controller is configured to switch between a single-point irradiation mode and a multi-point irradiation mode. The single-point irradiation mode refers to a mode in which the adjustment mechanism is controlled such that the focal point of the plurality of laser beams falls on the thin film. The multi-point irradiation mode refers to a mode in which the adjustment mechanism is controlled such that the focal point does not fall on the thin film.

Abstract: A multilayer ceramic capacitor includes a capacitor main body, and two interposers on both sides in a length direction of a surface of the capacitor main body. When a distance between a side surface of one interposer on one side in the length direction, and a side surface of the capacitor main body is defined as X1, a distance between another side surface of the one interposer, and another side surface of the capacitor main body is defined as X4, a distance between a side surface of another interposer on another side in the length direction, and the side surface of the capacitor main body is defined as X2, and a distance between another side surface of the other interposer on the other side in the length direction, and the other side surface of the capacitor main body is defined as X3; X2>X3 and X1>X4 are satisfied.

Abstract: In a multilayer ceramic capacitor, a positional deviation in a lamination direction between end portions in a width direction intersecting the lamination direction and a length direction, of two of internal electrode layers adjacent to each other in the lamination direction, is about 5 ?m or less. A connection ratio N1/N0 at the middle portion thereof, and a connection ratio N2/N0 at the end portion thereof are about 90% or more, respectively, and a difference between N1/N0 and N2/N0 is about 10% or less.

Abstract: A method of manufacturing a multilayer ceramic capacitor includes alternately laminating dielectric layers and internal electrode layers to manufacture a multilayer body, forming an external electrode connected with the internal electrode layers on each of two end surfaces of the multilayer body to manufacture a capacitor main body, connecting two interposers via a plate-shaped member, connecting the two interposers and the external electrode, and removing the plate-shape member.

Abstract: An antenna installation structure includes an antenna substrate, an insulation layer, and a bonding material. The antenna substrate includes a dielectric base including a first main surface and a second main surface, and an antenna conductor and a ground conductor which are on the first main surface and are separated from each other. The insulation layer is in contact with the first main surface of the antenna substrate. The bonding material is between the insulation layer and a radiation side wall of a housing and is in contact with the insulation layer and the radiation side wall. The porosity of the insulation layer is lower than the porosity of the bonding material.

Abstract: A radio frequency module includes a module substrate including a first main surface facing a second main surface, and a power amplifier including first and second power amplification devices and an output transformer, which includes a primary coil and a secondary coil, and a capacitor connected to the output transformer. One end of the primary coil is connected to the first amplification device. Another end of the primary coil is connected to the second amplification device. One end of the secondary coil is connected to an output terminal. The output transformer is disposed in or on the module substrate and is disposed closer to one of the first and second main surfaces than the other. The capacitor is disposed in or on the other of the first and second main surfaces and is disposed to overlap the output transformer when the module substrate is viewed in a plan view.

Abstract: A ferrite sintered body comprising Co and Fe, wherein the Co is contained in an amount of from 38 mol % to 60 mol % in terms of CoO, the Fe is contained in an amount of from 40 mol % to 50 mol % in terms of Fe2O3, and the sintered body has an average particle size of from 1.0 ?m to 5.0 ?m.

Abstract: A radio-frequency integrated circuit processes a radio-frequency signal to be transmitted or received by an antenna. The radio-frequency integrated circuit is implemented on a first substrate. The first substrate is implemented on a second substrate. A connector for connection with a cable through which a modulation signal is transferred to the radio-frequency integrated circuit is implemented on the second substrate. A first shield structure covers the connector. An antenna module in which noise due to the connector is less likely to influence antenna characteristics is provided.

Abstract: A radar device that includes a radar module and a vibrator. An example of the vibrator is an actuator, which generates vibration with a magnitude smaller than the range resolution of the radar device. A shield case is supported on a bracket with a fixing portion interposed therebetween. The fixing portion is made of an elastic material. As the actuator vibrates, the shield case vibrates irregularly, and the vibration of the shield case is transmitted to a circuit board. On the front side of the circuit board, a pattern constituting an array antenna is formed.

Abstract: A spectrum analysis program causing a computer system to execute: generating, using an AF method, first frequency spectrum data having continuous frequency values from a wireless signal, generating, using a frequency spectrum analysis method for outputting reference power values for the wireless signal, second frequency spectrum data having discrete frequency values from the wireless signal, pairing, with each other, frequency values that are closest among frequency values of the first frequency spectrum data and frequency values of the second frequency spectrum data, and generating, based on a comparison between a first power value at a first frequency in the first frequency spectrum data and a second power value at a second frequency corresponding to the first frequency in the second frequency spectrum data, frequency spectrum data serving as an analysis result.

Abstract: An antenna module includes dielectric substrates whose normal directions are different from each other, emitting elements disposed on the dielectric substrate, and emitting elements disposed on the dielectric substrate. The emitting element and the emitting element are capable of emitting radio waves of a first frequency band. The emitting element and the emitting element are capable of emitting radio waves of a second frequency band higher than the first frequency band. The emitting element is disposed adjacent to the emitting element in a case where the dielectric substrate is viewed in a plan view from the normal direction. On the dielectric substrate, the emitting element is disposed at a position that is farther from the dielectric substrate than the emitting element is.

Abstract: A micro lens array that includes a planar array antenna including a plurality of planar antennas formed on a substrate, a plurality of dielectric lenses each provided above each of the plurality of planar antennas, and a plurality of dielectric plates each provided on part of the substrate, the part being provided between two adjacent dielectric lenses of the plurality of dielectric lenses.

Abstract: A radio-frequency module includes a module substrate having major surfaces that are opposite to each other, a plurality of electronic components disposed at the major surface and at the major surface, and a plurality of post electrodes that are disposed at the major surface and that include a power supply terminal. The plurality of electronic components includes an integrated circuit that is disposed at the major surface and that includes a control circuit coupled to the power supply terminal. The plurality of electronic components also include a capacitor that is disposed at the major surface and that is coupled between the path connecting the power supply terminal to the control circuit and ground. The power supply terminal is disposed closer to the capacitor than any other post electrodes; and/or the capacitor is disposed closer to the power supply terminal than any other electronic component disposed at the major surface.

Abstract: In a multilayer board, a transmission line includes layers including a first insulator layer, a first joining material layer in contact with a first surface of the first insulator layer, and a second joining material layer in contact with a second surface of the first insulator layer. A signal conductor of the transmission line is on the first surface of the first insulator layer, a relative permittivity of the second joining material layer is lower than a relative permittivity of the first joining material layer, and an adhesion strength between the first insulator layer and the first joining material layer is higher than an adhesion strength between the first insulator layer and the second joining material layer.

Abstract: A multilayer body includes a first electronic component and a structural body including first and second regions. The first electronic component is in the second region. The multilayer body includes a second electronic component mounted via a solder bump onto the structural body with a connection pad interposed therebetween. An outer surface of the first region and an outer surface of the first electronic component have a step difference therebetween in a height direction of the structural body. The connection pad is on the outer surface of the first region, an outer surface of the first electronic component, and a step-difference surface of a portion of the step difference.

Abstract: An antenna module including a dielectric substrate formed by stacking a plurality of dielectric layers, a radiating element formed on or in the dielectric substrate, a ground electrode facing the radiating element, and peripheral electrodes that are formed in a plurality of layers between the radiating element and the ground electrode at an outer periphery of the dielectric substrate.

Abstract: An acoustic resonator device with low thermal impedance has a substrate and a single-crystal piezoelectric plate having a back surface attached to a top surface of the substrate via a bonding oxide (BOX) layer. An interdigital transducer (IDT) formed on the front surface of the plate has interleaved fingers disposed on a diaphragm of the plate that is formed over a cavity in the substrate. The piezoelectric plate and the BOX layer are removed from a least a portion of the surface area of the substrate to provide lower thermal resistance between the IDT and the substrate.

Abstract: A flexible substrate includes a base substrate that has flexibility, connecting portions on the base substrate and connectible to an antenna substrate and a circuit substrate, and a first line and a second line at the base substrate and connected to the connecting portions. The first line and the second line include a first region in which the first line and the second line extend in parallel or substantially in parallel with each other, and a second region in which the first line and the second line are closer to each other than in the first region and coupled to each other, and the second region defines a directional coupler.