Abstract: An electroconductive paste that includes an inorganic filler which contains a spherical Cu powder of 3 ?m or less in average particle size; a flat Cu powder of 3 or more in aspect ratio and 10 ?m or more in average particle size; glass frit; and a spherical inorganic powder of 30 ?m or more in average particle size, the spherical inorganic powder including an inorganic material that is not melted in a heat treatment step for baking. The spherical inorganic powder is contained in a proportion of 10 to 35 parts by volume with respect to 100 parts by volume of a mixture of the spherical Cu powder and the flat Cu powder. In addition, the proportion of the flat Cu powder falls within the range of 10 to 50% by volume with respect to the total amount of the spherical Cu powder and flat Cu powder.