Patents Assigned to Mutsuki Electric Co., Ltd.
  • Patent number: 11958276
    Abstract: There are provided a metal-resin joint having high bonding strength and a manufacturing method thereof. A metal-resin joint 10 of the present disclosure includes an anchor portion 34 provided on a metal bonding surface 32 of a metal member 30. The anchor portion 34 has a pair of protrusion strips 35 and 35 protruding from the metal bonding surface 32 with a gap, a recessed groove 36 provided between the pair of protrusion strips 35 and 35, and a plurality of partitions 37 protruding from a groove bottom of the recessed groove 36. The plurality of partitions 37 are provided to be inclined toward one side Y1 in a direction in which the pair of protrusion strips 35 and 35 extend as going toward a distal end side, and to be side by side in a direction Y in which the pair of protrusion strips 35 and 35 extend.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: April 16, 2024
    Assignee: MUTSUKI ELECTRIC CO., LTD.
    Inventor: Seiichi Sai
  • Publication number: 20220410523
    Abstract: There are provided a metal-resin joint having high bonding strength and a manufacturing method thereof. A metal-resin joint 10 of the present disclosure includes an anchor portion 34 provided on a metal bonding surface 32 of a metal member 30. The anchor portion 34 has a pair of protrusion strips 35 and 35 protruding from the metal bonding surface 32 with a gap, a recessed groove 36 provided between the pair of protrusion strips 35 and 35, and a plurality of partitions 37 protruding from a groove bottom of the recessed groove 36. The plurality of partitions 37 are provided to be inclined toward one side Y1 in a direction in which the pair of protrusion strips 35 and 35 extend as going toward a distal end side, and to be side by side in a direction Y in which the pair of protrusion strips 35 and 35 extend.
    Type: Application
    Filed: August 7, 2020
    Publication date: December 29, 2022
    Applicant: Mutsuki Electric Co., Ltd.
    Inventor: Seiichi Sai
  • Patent number: 11426947
    Abstract: A method for manufacturing a metal-resin joint 30 according to the present disclosure is a method for manufacturing the metal-resin joint 30 in which a synthetic resin member 10 made of thermoplastic resin and a metal member 20 made of metal are bonded to each other, the method including: a first process of exposing a surface 12 of the synthetic resin member 10 molded into a predetermined shape, to air heated to a first temperature T1 equal to or higher than a deflection temperature under load Tf of the thermoplastic resin when a load of 1.8 MPa is applied; and a second process of bonding the surface 12 of the synthetic resin member 10 and a surface 22 of the metal member 20 to each other. Accordingly, it is possible to improve the bonding strength between the metal member 20 and the synthetic resin member 10.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: August 30, 2022
    Assignee: MUTSUKI ELECTRIC CO., LTD.
    Inventor: Seiichi Sai
  • Publication number: 20220168965
    Abstract: A method for manufacturing a metal-resin joint 30 according to the present disclosure is a method for manufacturing the metal-resin joint 30 in which a synthetic resin member 10 made of thermoplastic resin and a metal member 20 made of metal are bonded to each other, the method including: a first process of exposing a surface 12 of the synthetic resin member 10 molded into a predetermined shape, to air heated to a first temperature T1 equal to or higher than a deflection temperature under load Tf of the thermoplastic resin when a load of 1.8 MPa is applied; and a second process of bonding the surface 12 of the synthetic resin member 10 and a surface 22 of the metal member 20 to each other. Accordingly, it is possible to improve the bonding strength between the metal member 20 and the synthetic resin member 10.
    Type: Application
    Filed: March 6, 2020
    Publication date: June 2, 2022
    Applicant: Mutsuki Electric Co., Ltd.
    Inventor: Seiichi Sai
  • Patent number: 11090908
    Abstract: A surface of a metal substrate formed from a metal is heated, an oxide film is formed on the surface of the metal substrate, at least a portion of the oxide film is heated so as to increase a joining strength of the oxide film to the metal substrate, subsequently a synthetic resin substrate formed from a synthetic resin is joined to the oxide film, and thus a metal-resin joined body is obtained. Thereby, a metal-resin joined body having high joining strength is obtained.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: August 17, 2021
    Assignee: MUTSUKI ELECTRIC CO., LTD.
    Inventor: Seiichi Sai
  • Publication number: 20200070477
    Abstract: A surface of a metal substrate formed from a metal is heated, an oxide film is formed on the surface of the metal substrate, at least a portion of the oxide film is heated so as to increase a joining strength of the oxide film to the metal substrate, subsequently a synthetic resin substrate formed from a synthetic resin is joined to the oxide film, and thus a metal-resin joined body is obtained. Thereby, a metal-resin joined body having high joining strength is obtained.
    Type: Application
    Filed: November 16, 2017
    Publication date: March 5, 2020
    Applicant: Mutsuki Electric Co., Ltd.
    Inventor: Seiichi SAI