Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.

Abstract: A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are formed in a rigid substrate (RS) such that the RS is divided into a predetermined removed region (PRR1) and a predetermined reserved region (PRR2) according to the arrangement of the TPs. Next, a conductive bonding layer (CBL) and a flexible circuit board (FCB) are respectively laminated on two opposite sides of the RS and part of a dielectric bonding layer of the CBL fills the TPs. Next, the RS, the FCB and the CBL are bent according to the TPs such that the PRR2 is bent at the TPs relative to the PRR1. Finally, part of the RS located at the PRR1 and part of the CBL corresponding to the PRR1 are removed to form an indentation to expose part of the FCB.

Abstract: A package substrate including a circuit board and a heat-dissipating element is provided. The circuit board has a through opening adapted for accommodating an electronic element. The heat-dissipating element is disposed at the circuit board and covers one side of the through opening. The heat-dissipating element includes a heat-dissipating plate, an adhesive layer and an antioxidation layer. The heat-dissipating plate has a first surface facing the through opening and a second surface opposite to the first surface. The adhesive layer is disposed on the first surface and the heat-dissipating plate adheres to the circuit board through the adhesive layer. The antioxidation layer is disposed on the second surface. An electronic assembly including the package substrate is also provided.

Abstract: A combined circuit board including a flexible circuit board (FCB), a rigid circuit board (RCB), and first and second conductive vias (CVs) is provided. The FCB includes a flexible dielectric layer (DL) and a circuit layer (CL) disposed thereon. The RCB includes a rigid DL and a CL including a main circuit (MC) and an out connection interface circuit (OCIC). The rigid DL is disposed on the FCB and includes first and second rigid dielectric portions (RDPs) apart from each other by a distance such that part of the FCB is exposed outside. The MC and the OCIC are disposed on the first and the second RDPs, respectively. The first CV disposed in the second RDP electrically connects a contact of the OCIC and the CL of the FCB. The second CV disposed in the first RDP electrically connects the MC and the CL of the FCB.

Abstract: A package substrate including a circuit board and a heat-dissipating element is provided. The circuit board has a through opening adapted for accommodating an electronic element. The heat-dissipating element is disposed at the circuit board and covers one side of the through opening. The heat-dissipating element includes a heat-dissipating plate, an adhesive layer and an antioxidation layer. The heat-dissipating plate has a first surface facing the through opening and a second surface opposite to the first surface. The adhesive layer is disposed on the first surface and the heat-dissipating plate adheres to the circuit board through the adhesive layer. The antioxidation layer is disposed on the second surface. An electronic assembly including the package substrate is also provided.

Abstract: A packaged structure having a magnetic component and a method of manufacturing the same are provided. The packaged structure includes an insulating substrate having a ring-typed recess, an island portion and a surrounding portion defined by the ring-typed recess, wherein the ring-typed recess is laterally between the island portion and the surrounding portion.

Abstract: A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are formed in a rigid substrate (RS) such that the RS is divided into a predetermined removed region (PRR1) and a predetermined reserved region (PRR2) according to the arrangement of the TPs. Next, a conductive bonding layer (CRL) and a flexible circuit board (FCB) are respectively laminated on two opposite sides of the RS and part of a dielectric bonding layer of the CBL fills the TPs, Next, the RS, the FCB and the CBL are bent according to the TPs such that the PRR2 is bent at the TPs relative to the PRR1, Finally, part of the RS located at the PRR1 and part of the CBL corresponding to the PRR1 are removed to form an indentation to expose part of the FCB.

Abstract: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate.

Abstract: A multilayer circuit board includes a first circuit layer, an insulating layer, a second circuit layer, an intermediate frame, an electronic element, and a third circuit layer. The insulating layer is disposed on the first circuit layer, and the second circuit layer is disposed on the insulating layer. The intermediate frame is disposed on the second circuit layer and has an accommodating space. The electronic element is disposed on the second circuit layer, electrically connected to the second circuit layer and located in the accommodating space. The third circuit layer is disposed on the intermediate frame.

Abstract: A combined multilayered circuit board is provided. The combined multilayered circuit board includes a plurality of multilayered circuit boards, at least one of the plurality circuit boards being formed with an embedded electronic component and an internal chamber receiving the embedded electronic component. The internal chamber is full of air. The combined multilayered circuit board further includes at least one glue layer interposed between each of the plurality of multiple circuit boards for bonding the plurality of multilayered circuit boards together.

Abstract: The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit.

Abstract: A manufacturing process of an embedded type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the copper foil according to the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic layer and the organic layer is solidified.

Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed.

Abstract: A method for forming a molded circuit board is provided. The method includes the steps of forming a circuit having a first section and a second section on a conductive substrate, the first section and the second section being coplanar; then deforming the conductive substrate by mold-pressing, so that the first section and the second section become non-coplanar; providing a plastic material to cover the circuit and the conductive substrate; curing the plastic material by injection-molding; and removing the conductive substrate to expose the circuit. The molded circuit board made by this method is also provided.

Abstract: The present invention discloses a printed circuit board. The printed circuit board is made by the method of providing a substrate; forming a first circuit on the substrate; depositing a thin film on the substrate; building an electronic component on the substrate by the thin film and allowing the electronic component to electrically connect the first circuit; forming a blanket dielectric layer enclosing the electronic component; and removing the substrate.

Abstract: A method of providing at least two multilayer circuit boards, combining the at least two multilayer circuit boards to form a combined multilayer circuit board, and forming multiple outer conductive vias, circuits and contacts on the combined multilayer circuit board. Each multilayer circuit board is fabricated by the steps of preparing a single-layer printed circuit board having multiple chip sections, attaching at least one chip to the corresponding chip section, attaching a frame having multiple enclosures to the single-layer printed circuit board, attaching a semi-fluid glue sheet to the frame, vacuum pressing a conductive layer on the semi-fluid glue sheet and forming multiple conductive inner vias through the multilayer circuit board. The at least two multilayer circuit boards are combined by steps of reversing one of the multilayer circuit boards and vacuum pressing other multilayer circuit boards on the reversed multilayer circuit board.

Abstract: A multilayer circuit board has a bottom and an upper multilayer circuit boards, a glue layer, multiple outer contact vias and two insulating lacquer layers. The bottom and the upper multilayer circuit boards respectively have multiple conductive wires, an insulating layer, a frame, multiple chips, a press laminate, a patterned conductive layer and at least one inner contact via. The glue layer sticks the bottom and the upper multilayer circuit boards together. The multiple contact vias are formed through the bottom and the upper multilayer circuit boards to electronically interconnect the conductive wires and the patterned conductive layers in the bottom and the upper multilayer circuit boards. The insulating lacquer layers are respectively coated under and on portions of the patterned conductive layers in the bottom and the upper multilayer circuit boards to protect the patterned conductive layers, wherein the un-coated patterned conductive layers become multiple contacts.

Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting component, and a first light diffusion layer, wherein the light emitting component is disposed on the patterned conductive layer and the light emitting component and the patterned conductive layer are embedded into the first light diffusion layer. The method for manufacturing the light emitting apparatus is also disclosed.

Abstract: The present invention discloses an interconnection structure which is formed by a method comprising providing a first conductive substrate, a second conductive substrate, and an insulating substrate; respectively forming a first circuit and a second circuit on the first conductive substrate and the second conductive substrate; forming a conductive bump on the second circuit; and connecting the insulating substrate with the first circuit and the second circuit by pressing the first conductive substrate, the insulating substrate and the second conductive substrate, wherein the conductive bump penetrates the insulating substrate to contact the first circuit.

Abstract: A light emitting apparatus includes a patterned conductive layer, a light emitting device on the patterned conductive layer, and a first light diffusion layer. The light emitting device and the patterned conductive layer are embedded in the first light diffusion layer. A method of forming such a light emitting apparatus is also disclosed.