Abstract: An earphone device capable of achieving sound bandwidths beyond the 150-7000 Hz wideband range, and configured for supra-concha or supra-aural placement. The earphone comprises at least two frequency range receivers positioned within a housing. In at least one embodiment, the earphone is capable of achieving a super-wideband range by physically combining a low frequency range receiver and a high frequency range receiver in a space-efficient and acoustically advantageous manner.

Abstract: A transducer assembly utilizing at least two MEMS transducers is provided, the transducer assembly preferably defining either an omnidirectional or directional microphone. In addition to at least first and second MEMS transducers, the assembly includes a signal processing circuit electrically connected to the MEMS transducers, a plurality of terminal pads electrically connected to the signal processing circuit, and a transducer enclosure housing the first and second MEMS transducers. The MEMS transducers may be electrically connected to the signal processing circuit using either wire bonds or a flip-chip design. The signal processing circuit may be comprised of either a discrete circuit or an integrated circuit. The first and second MEMS transducers may be electrically connected in series or in parallel to the signal processing circuit. The first and second MEMS transducers may be acoustically coupled in series or in parallel.

Abstract: A surface mountable package for use with an audio transducer is provided. In addition to the audio transducer, the surface mountable package includes a substrate, a cover, and a transducer support frame mounted within, and attached to, the substrate and cover. The support frame includes one or more cavities that, in combination with the audio transducer, substrate and cover, define the front and rear acoustic cavity volumes.

Abstract: A surface mountable package for use with an audio transducer is provided. In addition to the audio transducer, the surface mountable package includes a substrate, a cover, and a transducer support frame mounted within, and attached to, the substrate and cover. The support frame includes one or more cavities that, in combination with the audio transducer, substrate and cover, define the front and rear acoustic cavity volumes.

Abstract: A surface mountable transducer package is provided, the design of which allows a thin package profile to be achieved. An encapsulation layer bonds to a surface of each of the terminal pads and encapsulates a portion of the transducer and at least a portion of the signal processing IC.

Abstract: A transducer package fabrication process is provided, the completed transducer package achieving a thin package profile. The fabrication process utilizes an encapsulation material to eliminate the need for a transducer support substrate, the encapsulation material isolating the terminal pads from one another while holding the transducer and signal processing IC in position.

Abstract: A system and method for RF immunity of an electret condenser microphone. In one embodiment, the microphone comprises a printed wire board, an amplifier, a capacitor. The amplifier and the capacitor are mounted on the printed wire board such that longitudinal axis, i.e., the axis defined by the line between the output pin and the ground pin, of the capacitor is perpendicular to the longitudinal axis of the amplifier. According to one embodiment of the method of the present invention, an electret condenser microphone according to the present invention is provided, and current is provided to the capacitor to result in the creation of a magnetic field about the longitudinal axis of the capacitor. The magnetic field created is positioned such that it does not significantly contribute to the generation of RF current in the amplifier.

Abstract: A telephone handset that includes both a speaker and a secondary flux coil is provided. The secondary flux coil provides improved inductive coupling between the handset and a hearing aid. Due to the wiring configuration of the handset, the speaker and the secondary flux coil can be independently filtered, thus providing means for independently optimizing the performance of both the speaker and the secondary flux coil. Suitable filters include both passive circuits and digital signal processors.

Abstract: An earphone device capable of achieving sound bandwidths beyond the 150-7000 Hz wideband range, and configured for supra-concha or supra-aural placement. The earphone comprises at least two frequency range receivers positioned within a housing. In at least one embodiment, the earphone is capable of achieving a super-wideband range by physically combining a low frequency receiver and a high frequency receiver in a space-efficient and acoustically advantageous manner.

Abstract: A telephone handset that includes both a speaker and a secondary flux coil is provided. The secondary flux coil provides improved inductive coupling between the handset and a hearing aid. Due to the wiring configuration of the handset, the speaker and the secondary flux coil can be independently filtered, thus providing means for independently optimizing the performance of both the speaker and the secondary flux coil. Suitable filters include both passive circuits and digital signal processors.

Abstract: An automotive microphone assembly. According to one embodiment of the present invention, the assembly comprises a first microphone, a second microphone, a connection means, and a housing. The connection means provides for electrical connection to the first and second microphones, and for connection to a first automotive subsystem and a second automotive subsystem, respectively. The first subsystem and second subsystem may comprise a telephony subsystem, speech recognition subsystem, speech recording subsystem, intercom subsystem, noise control subsystem, noise compensation subsystem, or noise monitoring subsystem. By use of the assembly of the present invention, a single microphone assembly may be used in support of multiple automotive subsystems, thereby saving space in the automobile and realizing costs savings in having a single assembly. In addition, the assembly is comprised of reasonably priced components, is easy to assemble, and permits for repair or replacement of the assembly or components thereof.

Abstract: A system and method for RF immunity of an electret condenser microphone. In one embodiment, the microphone comprises a printed wire board, an amplifier, a capacitor. The amplifier and the capacitor are mounted on the printed wire board such that longitudinal axis, i.e., the axis defined by the line between the output pin and the ground pin, of the capacitor is perpendicular to the longitudinal axis of the amplifier. According to one embodiment of the method of the present invention, an electret condenser microphone according to the present invention is provided, and current is provided to the capacitor to result in the creation of a magnetic field about the longitudinal axis of the capacitor. The magnetic field created is positioned such that it does not significantly contribute to the generation of RF current in the amplifier.