Abstract: Systems and methods provide for manufacturing and assembling a single package gas sensor. The method includes: disposing a substrate in a housing; disposing at least one gas sensor die on the substrate; disposing at least one ultraviolet (UV) light emitting diode (LED) on the substrate; and attaching a lid to the housing, wherein the lid includes at least one gas ingress point.
Type:
Grant
Filed:
September 14, 2018
Date of Patent:
April 20, 2021
Assignee:
N5 SENSORS, INC.
Inventors:
Abhishek Motayed, Ratan Debnath, Brian Thomson