Patents Assigned to Naganoken
  • Tin-silver alloy plating bath and process for producing plated object using the plating bath
    Patent number: 5948235
    Abstract: In the present invention, the tin-silver-system alloy plating solution comprising following five fundamental ingredients (a)-(e): (a) a tin compound; (b) a silver compound; (c) at least one member selected from a group consisting of bismuth compounds and copper compounds; (d) a pyrophosphoric compound; and (e) an iodic compound. By the present invention, the tin-silver-system alloy layer, which can be employed instead of tin-lead solder alloy layer, can be formed without using harmful compounds: cyanide, lead compounds, etc..
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: September 7, 1999
    Assignees: Naganoken, Shinko Electric Industries Co., Ltd.
    Inventor: Susumu Arai