Patents Assigned to Naganoken and Shinko Electric Industries Co., Ltd.
  • Aqueous solution for forming metal complexes, tin-silver alloy plating bath, and process for producing plated object using the plating bath
    Patent number: 5902472
    Abstract: A tin-silver alloy plating solution having a tin compound, a silver compound, and a complexing agent including a pyrophosphoric compound and an iodic compound. The tin-silver alloy layer composition can achieve a high electric current efficiency without using harmful compounds such as cyanides. The plating solution is very stable, possesses adhesivability, and the solder-wettability of the tin-silver alloy layer is satisfactory. Also, the alloy is an advantageous alloy for solder plating.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: May 11, 1999
    Assignee: Naganoken and Shinko Electric Industries Co., Ltd.
    Inventors: Susumu Arai, Tohru Watanabe, Mitsutoshi Higashi