Patents Assigned to NAGATA SEIKI CO., LTD.
  • Patent number: 8522645
    Abstract: In a vacuum chamber, the edge of each blade group is subjected to an ion beam treatment under predetermined conditions using a plasma ion gun and argon as a medium, and is subjected to a plasma ion implantation of nitrogen plasma under predetermined conditions using a plasma ion implantation gun. As a result, it is possible to provide a blade member having an edge of a cutting quality enhanced by increasing the sharpness, a blade member having an edge of a rigidity enhanced by increasing the hardness, and a working apparatus capable of working those edges efficiently.
    Type: Grant
    Filed: December 24, 2008
    Date of Patent: September 3, 2013
    Assignees: Nagata Seiki Co., Ltd., Kai R&D Center Co., Ltd.
    Inventors: Kensuke Uemura, Hiroshi Ohtsubo
  • Publication number: 20100288097
    Abstract: In a vacuum chamber, the edge of each blade group is subjected to an ion beam treatment under predetermined conditions using a plasma ion gun and argon as a medium, and is subjected to a plasma ion implantation of nitrogen plasma under predetermined conditions using a plasma ion implantation gun. As a result, it is possible to provide a blade member having an edge of a cutting quality enhanced by increasing the sharpness, a blade member having an edge of a rigidity enhanced by increasing the hardness, and a working apparatus capable of working those edges efficiently.
    Type: Application
    Filed: December 24, 2008
    Publication date: November 18, 2010
    Applicants: NAGATA SEIKI CO., LTD., KAI R & D CENTER CO., LTD.
    Inventors: Kensuke UEMURA, Hiroshi OHTSUBO