Abstract: Provided is a method of forming a semiconductor thin film. The method may include forming, on a substrate, a thin film that contains one of Ge, Si, and a SiGe mixture, and Sn in a content of 0.1 atomic % or more to 20 atomic % or less, and applying pulsed laser light to the thin film.
Type:
Application
Filed:
August 28, 2015
Publication date:
December 24, 2015
Applicants:
NAGOYA UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, GIGAPHOTON INC., KYUSHU UNIVERSITY, NATIONAL UNIVERSITY CORPORATION