Abstract: The invention relates to a method for fabricating electronic cards by A) forming a plurality of card bodies in the form of a thick sheet with a plurality of electronic units or modules embedded in the sheet; B) printing a plurality of first patterns on a first face of the thick sheet in a printing station where ink is applied on the first face; C) applying a first at least partially transparent coating on each printed first pattern, that adheres to the card body. The method can also include printing a plurality of second patterns on the inner surface of a film forming the first coating. Preferably, the printing of the first patterns is carried out in an offset type station for printing high definition patterns, essentially of the security type. The second patterns define personal data. The printed thick sheet defines an intermediate product according to the invention.

Abstract: The invention relates to a method for manufacturing boards that comprises depositing a liquid resin (22) on and/or under a plurality of electronic units for forming a plate defining a plurality of boards or board bodies. In order to do so, and in order to reduce as much as possible the residual air bubbles in the manufactured plate, the method comprises depositing the resin in the form of resin beads (26) initially having between them grooves (28) defining air discharge channels. The resin in uniformly spread using a pressing roller for one end of the plate to a second opposite end of the plate.

Abstract: The invention relates to a method for fabricating electronic cards, that comprises the following steps: A) forming a plurality of card bodies in the form of a thick sheet (36) in which is respectively imbedded a plurality of electronic units or modules (28); B) printing a plurality of first patterns (14) on a first face (21) of said thick sheet in a printing station in which ink is applied on the first face for making said first patterns; C) applying a first at least partially transparent coating (38) on each printed first pattern, that adheres to said card body. In an advanced embodiment, the method also comprises printing a plurality of second patterns (40) on the inner surface of a film (38) forming said first coating. Preferably, the printing of the first patterns is carried out in an offset type station for printing high definition patterns, essentially of the security type. The second patterns define personal data.

Abstract: The plastic sheet (22), involved in the formation of a plurality of smart cards which respectively include a plurality of electronic units, is formed of a first material (2), having a first hardness or a first Vicat softening temperature, and of a second material (6) having a second hardness lower than the first hardness, respectively a second Vicat softening temperature lower than the first Vicat softening temperature. The second material is located in a plurality of areas of the plastic sheet which are respectively intended to at least partially receive said plurality of electronic units, via penetration of this plurality of electronic units into the second material during fabrication of the plurality of smart cards.

Abstract: A method of manufacturing a card including an electronic module by providing a frame or a plate having at least one aperture for receiving the electronic module. At least one part of the peripheral area of the aperture is deformed or crushed by localized application of pressure, so as to reduce locally the thickness of the frame or plate in the peripheral area. The electronic module is brought opposite the corresponding aperture so a zone of the electronic module is superposed on a part of the peripheral area, and a material connection is established between the part of the peripheral area and the corresponding zone of the electronic module for assembling the electronic module to the frame or plate before a resin is subsequently added to at least one side of the electronic module.

Abstract: The smart card (98A) comprises an external connector (90), which is formed of an insulating support (6) and a plurality of external metal contact pads (4) arranged on the external face of said insulating support. The card body has a housing in which the external connector is arranged and includes an electronic unit and/or an antenna electrically connected to a plurality of internal metal contact pads (20), which are arranged underneath the external connector and respectively aligned with the plurality of external metal contact pads. The plurality of external metal contact pads are respectively electrically connected to the plurality of internal metal contact pads by a plurality of metal parts (100), which are each at least partially formed by a solder material and which traverse said insulating support through respective apertures (92).

Abstract: The card forming a support for a valuable object, particularly a small precious metal ingot incorporated in said card, includes a core with a through aperture in which said valuable object is arranged, said through aperture having larger dimensions than those defined by the contour of said valuable object in the main geometric plane of said card. This valuable object is located in a central area of the through aperture so that a transparent peripheral area surrounds the valuable object inside said through aperture. The valuable object is embedded in a transparent resin which entirely fills the area peripheral to said valuable object between said object and the contour of the through aperture, so that the space remaining in the aperture around the valuable object is entirely filled by the resin.

Abstract: The assembly (22) involved in the fabrication of electronic cards comprises a plate (14) exhibiting a plurality of apertures (16) in which are respectively housed a plurality of electronic modules (2). These electronic modules are assembled to the plate 14 by fixing means, in particular by fixing bridges leaving a slot (26) over the major part of the surround of the electronic module. For example the fixing means are formed by projecting parts (18) at the periphery of the apertures (16), these projecting parts exhibiting a smaller thickness than the thickness of the plate (14) and serving as supports for the electronic modules, in particular for a substrate (12) of these modules. Fixing is performed for example by welding or adhesive bonding. The invention also relates to an intermediate product formed by such an assembly and a filing material that fills at least the major part of the remaining space in the apertures (16).

Abstract: The invention relates to a card including a digital display arranged in a core defining the central portion of the card. The card further comprises a plastic layer the major portion of which is opaque, and a transparent display portion. In a preferred variant, the plastic layer is covered with a transparent film attached thereto by a thin glue layer defining an adhesion interface. More particularly, the invention relates to an intermediate product intervening in a batch manufacture of such cards, wherein the intermediate product is formed by an opaque plastic sheet having a plurality of apertures defining windows for a respective plurality of corresponding electronic displays, and wherein a plurality of transparent parts are respectively arranged in the plurality of apertures and assembled to the opaque plastic sheet. The invention also relates to a manufacturing method of such an intermediate product.

Abstract: The invention relates to a card (38) including a digital display (10) arranged in a node (4) defining the central portion of the card. It further comprises a plastic layer (40) the major portion (42) of which is opaque, and a transparent display portion (44). A pattern (14) is printed on the upper face of the plastic layer (40), in particular by an offset printing technique. The plastic layer (40) is covered with a transparent film (12) attached thereto by a thin glue layer (34) defining an adhesion interface. The electronic display (10) is fully integrated in the card (38) and the printed pattern (14) exhibits a good contrast on the opaque portion of said plastic layer. Furthermore, a good adhesion is obtained between all the layers of the card.

Abstract: A method of manufacturing complex electronic cards is provided, each card including an electronic device or assembly formed of a first electronic unit at least partially arranged in a window in a solid bottom layer of the card and a second electronic unit, incorporated in the body of the card, at least partially formed by resin provided on the solid bottom layer. In order to prevent the resin from flowing into a slit between the lateral wall of the window and the second unit inserted therein, a protective film is arranged to cover the edge of the rear face of the first unit and a zone peripheral to the aperture in the solid layer. The electronic device or assembly is first formed and then placed on the bottom solid layer. The protective film is arranged between the two units after or when the electronic device or assembly is formed.

Abstract: A method of manufacturing a card including an electronic module provides a frame or plate having at least one aperture for receiving the electronic module, is characterized in that at least one part of the peripheral area of at least one aperture is deformed to locally reduce the thickness of the frame in the at least one part of the peripheral area, in that the electronic module is brought opposite the corresponding aperture so that at least one zone of the electronic module is superposed on the at least one part of the peripheral area, and in that a connection is established between the at least one part of the peripheral area and the at least one corresponding zone of the electronic module for assembling the electronic module to the frame before a resin is added at least on one side of the electronic module.

Abstract: The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip.

Abstract: This invention proposes a manufacturing process for a transponder in the form of a card or a label able to resist to flexions or twisting without interrupting the connections of the electronic components. The process of assembling at least one electronic component including sensibly flat conductive areas that are connected to conductive tracks placed on the surface of a generally flat substrate comprises the steps of placing the substrate on a work surface, the face including conductive tracks being oriented upwards, placing the electronic component into a cavity of the substrate situated in a zone including the conductive tracks, the conductive areas of the component coming into contact with the corresponding tracks of the substrate and applying a layer of insulating material which extends at once on the electronic component and at least on a substrate zone surrounding said component.

Abstract: The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a substrate, of at least one electronic assembly comprising a chip having at least one electric contact on one of its faces, said contact being intended to be electrically connected to a conductive track segment. The electronic assembly is built on a holding device which seizes and holds at least one conductive track segment previously formed and a chip. A placement device places this electronic assembly thus built at a predetermined position relative to the substrate and embeds or inserts said electronic assembly into the substrate.

Abstract: The invention relates to a card including a digital display arranged in a core defining the central portion of the card. The card further comprises a plastic layer the major portion of which is opaque, and a transparent display portion. In a preferred variant, the plastic layer is covered with a transparent film attached thereto by a thin glue layer defining an adhesion interface. More particularly, the invention relates to an intermediate product intervening in a batch manufacture of such cards, wherein the intermediate product is formed by an opaque plastic sheet having a plurality of apertures defining windows for a respective plurality of corresponding electronic displays, and wherein a plurality of transparent parts are respectively arranged in the plurality of apertures and assembled to the opaque plastic sheet. The invention also relates to a manufacturing method of such an intermediate product.

Abstract: The present invention concerns a method of manufacturing complex electronic cards each including an electronic device or assembly (40) formed of a first electronic unit (4) at least partially arranged in a window in a solid bottom layer of the card and a second electronic unit (10), incorporated in the body of the card, at least partially formed by a resin provided on the solid bottom layer. In order to prevent the resin from flowing into a slit between the lateral wall of the window and the second unit inserted therein, a protective film is arranged to cover the edge of the rear face of the first unit and a zone peripheral to the aperture in the solid layer. According to the invention, the electronic device or assembly (40) is first formed and then placed on the bottom solid layer. The protective film is arranged between the two units after or when the electronic device or assembly is formed.

Abstract: The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip.

Abstract: The invention relates to a method for manufacturing boards that comprises depositing a liquid resin (22) on and/or under a plurality of electronic units for forming a plate defining a plurality of boards or board bodies. In order to do so, and in order to reduce as much as possible the residual air bubbles in the manufactured plate, the method comprises depositing the resin in the form of resin beads (26) initially having between them grooves (28) defining air discharge channels. The resin in uniformly spread using a pressing roller for one end of the plate to a second opposite end of the plate.

Abstract: The invention relates to a card (38) including a digital display (10) arranged in a node (4) defining the central portion of the card. It further comprises a plastic layer (40) the major portion (42) of which is opaque, and a transparent display portion (44). A pattern (14) is printed on the upper face of the plastic layer (40), in particular by an offset printing technique. The plastic layer (40) is covered with a transparent film (12) attached thereto by a thin glue layer (34) defining an adhesion interface. The electronic display (10) is fully integrated in the card (38) and the printed pattern (14) exhibits a good contrast on the opaque portion of said plastic layer. Furthermore, a good adhesion is obtained between all the layers of the card.