Abstract: A manufacturing method of housing structure of electronic device is provided. The manufacturing method includes stacking a first structural layer, a painting layer, and a second structural layer, wherein the painting layer is located between the first and the second structural layers. The layer stacked after the painting layer washes and squeezes at least a portion of the flowing painting layer to form a random texture pattern.
Type:
Application
Filed:
May 16, 2023
Publication date:
April 4, 2024
Applicants:
Acer Incorporated, Nan Pao New Materials (Huaian) Co., Ltd.
Inventors:
Pin-Chueh Lin, Wen-Chieh Tai, Cheng-Nan Ling, Chang-Huang Huang