Abstract: A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.

Abstract: A photosensitive assembly includes a circuit board, photosensitive chip coupled to the circuit board, the photosensitive chip includes a photosensitive area on an upper surface thereof and a non-photosensitive area surrounding the photosensitive area, and a package body packaged on the circuit board and covering a portion of the non-photosensitive area of the photosensitive chip, the package body includes an inner surface, and the inner surface has a curved surface on an edge thereof contacting the non-photosensitive area.

Abstract: An imaging lens includes, in order from an object side to an image side, a first lens having two surfaces both being convex aspheric surfaces; a second lens being aspherical and having a negative refractive power; a third lens being aspherical and having a positive refractive power; a fourth lens being aspherical and having a negative refractive power; and a fifth lens being aspherical, the fifth lens having a concave rear surface facing the image side on the optical axis, the rear surface having an inflection point at a position near its circumference, the fifth lens having a front surface facing the object side, the front surface having a smaller curvature than any other lens surface, and the fifth lens serves also as an infrared cut filter; wherein the imaging lens satisfies the following conditions: (1) TTL/2ih<0.85; and (2) 0.7<ih/f<1.1.

Abstract: The imaging lens includes at least one positive lens that satisfies predetermined conditional expressions (1) to (3) indicating conditions in which dispersion is relatively low and refractive index is high while having a negative rate of change of the refractive index. In a case where a lens that satisfies a conditional expression (4) meaning a low dispersion material is included, the lens that satisfies the conditional expression (4) satisfies a predetermined conditional expression (5).

Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly comprises includes a circuit board, a photosensitive chip, and a packaging body. The photosensitive chip is connected to the circuit board. The packaging body is formed on the circuit board. A through hole is formed in the packaging body. The through hole is opposite to the photosensitive chip to provide a light channel of for the photosensitive chip. An inner side surface of the through hole comprises includes a first cambered surface, a connection surface, and a second cambered surface, and the first cambered surface and the second cambered surface are respectively connected to two ends of the connection surface.

Abstract: An imaging optical system, including: a first lens being a meniscus lens with a positive refractive power, the first lens having a convex surface facing the object side; a second lens being a biconvex lens; a third lens being a meniscus lens with a negative refractive power, the third lens having a convex surface facing the object side; a fourth lens being a meniscus lens, the fourth lens having a convex surface or a concave surface facing the object side; a fifth lens having a concave surface facing the object side; and a sixth lens having a convex surface facing the image side; at least one surface of two surfaces of the lenses L1 to L6 has an aspherical shape. The imaging optical system satisfies the following conditions (1) and (2): 0.23<Y/f<0.29??(1) 0.9<TTL/f<1.0??(2).

Abstract: An imaging lens includes: a first lens having a convex surface facing the object side, and having a positive refractive power; a second lens being a meniscus lens having a negative refractive power; a third lens having a concave surface facing the imaging side; a fourth lens being a meniscus lens having a positive refractive power, having a convex surface facing the image side; a fifth lens having a negative refractive power, having a concave surface facing the image side on an optical axis, the surface facing the image side having an inflection point outside the optical axis; a sixth lens having a rear surface facing the image side and a front surface facing the object side, the rear surface being aspherical with a inflection point outside an optical axis, the front surface having a curvature less than other lenses' curvatures, the sixth lens serving as an infrared cut-off filter.

Abstract: A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.

Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly includes a circuit board, a photosensitive chip and a packaging body. The photosensitive chip is connected to the circuit board, and includes a photosensitive region and a non-photosensitive region surrounding the photosensitive region. The packaging body is formed on the circuit board and a portion of the non-photosensitive region of the photosensitive chip. The packaging body includes a top surface away from the photosensitive chip and an inner side surface connecting the top surface to the non-photosensitive region. A portion of the inner side surface adjacent to the top surface is a cambered surface, and the cambered surface has a larger surface area than an inclined plane, thus the cambered surface can carry more adhesive. In this way, it is possible to effectively prevent the adhesive from flowing to the photosensitive region of the photosensitive chip.

Abstract: A lens unit includes: a lens in which first and second circular portions are arranged in an optical axis direction, the first circular portion having a first diameter, the second circular portion having a second diameter larger than the first diameter; a sealing member that is annular when viewed in the optical axis direction and that has an inner peripheral surface that contacts an outer peripheral surface of the first circular portion; and a lens barrel including first and second inner wall portions, the first inner wall portion being circular when viewed in the optical axis direction and pressing the sealing member between the first inner wall portion and the first circular portion, the second inner wall portion having three or more contact portions that contact an outer peripheral surface of the second circular portion and that are arranged with spaces therebetween in a circumferential direction of the lens.

Abstract: A camera module includes a circuit board, a photosensitive chip coupled to the circuit board and having a photosensitive surface, a package material body attached on the circuit board, and a support member mounted on a side of the package material body away from the circuit board. The photosensitive surface includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body adjacent to the package material body is coplanar with a side of the extension structure adjacent to the package material body, and an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.

Abstract: A camera module includes a circuit board, a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package body packaged on the circuit board, and a bracket located on a side of the package body away from the circuit board. The package body includes a bearing surface away from the circuit board, and the bracket includes a first surface adjacent to the package body. A ratio between an area of the first surface and an area of the bearing surface is about 0.5 to about 1.2.

Abstract: A camera module includes: a circuit board; a photosensitive chip located on and coupled to the circuit board; a package body packaged on the circuit board; and a bracket located on a side of the package body away from the circuit board; wherein the bracket is provided with a step away from the package body, a sidewall of the step is inclined with respect to an optical axis of the camera module, a distance between the sidewall of the step and the optical axis gradually increase along a direction from the circuit to the package body, and an angle between the sidewall of the step and the optical axis ranges from 0.5° to 30°.

Abstract: Disclosed are a high-performance imaging lens which has a comparatively wide angle and in which, in particular, distortion is satisfactory corrected, and an imaging apparatus including the imaging lens. The imaging lens consists of, in order from an object side, a first lens L1 having negative refractive power, a second lens L2 having negative refractive power, a third lens L3 having positive refractive power, a fourth lens L4 having positive refractive power, a fifth lens L5, and a sixth lens L6. One of the fifth lens L5 and the sixth lens L6 has positive refractive power, and the other lens has negative refractive power. The following conditional expressions (1) and (2) are satisfied. ?0.37<f?/f1<?0.13??(1) 1.8<t3/f?<3.

Abstract: An imaging lens includes, in order from an object side to an image side, a first lens having two surfaces both being convex aspheric surfaces; a second lens being aspherical and having a negative refractive power; a third lens being aspherical and having a positive refractive power; a fourth lens being aspherical and having a negative refractive power; and a fifth lens being aspherical, the fifth lens having a concave rear surface facing the image side on the optical axis, the rear surface having an inflection point at a position near its circumference, the fifth lens having a front surface facing the object side, the front surface having a smaller curvature than any other lens surface, and the fifth lens serves also as an infrared cut filter; wherein the imaging lens satisfies the following conditions: (1) TTL/2ih<0.85; and (2) 0.7<ih/f<1.1.

Abstract: Disclosed are an imaging lens having satisfactory performance in a region of near infrared light, and an imaging apparatus including the imaging lens. The imaging lens includes, in order from an object side, as lenses having refractive power, only four lenses including a positive first lens L1, a negative second lens L2, a positive third lens L3, and a positive fourth lens L4. A conditional expression relating to a focal length fs1 of the first lens L1 with respect to s-line and a focal length fs of the entire system with respect to s-line: 0.5<fs1/fs<2.5 is satisfied.

Abstract: The imaging lens consists of, in order from an object side, a positive first lens L1, a negative second lens L2, a positive third lens L3, and a positive fourth lens L4. Conditional expressions relating to a focal length f of an entire system, a combined focal length f234 of the second lens L2 to the fourth lens L4, an Abbe number ?d1 of the first lens L1, an Abbe number ?d2 of the second lens L2, a radius of curvature R1 of a surface of the first lens L1 on the object side, and a radius of curvature R2 of a surface of the first lens L1 on an image side: 0.4<f/f234<2; ?d1<50; 5<?d1??d2<26; ?5<(R1+R2)/(R1?R2)<?0.9 are satisfied.

Abstract: The present disclosure relates to a camera module and a photosensitive assembly thereof. The photosensitive assembly includes a circuit board, a photosensitive chip and a packaging body. The photosensitive chip is connected to the circuit board, and includes a photosensitive region and a non-photosensitive region surrounding the photosensitive region. The packaging body is formed on the circuit board and a portion of the non-photosensitive region of the photosensitive chip. The packaging body includes a top surface away from the photosensitive chip and an inner side surface connecting the top surface to the non-photosensitive region. A portion of the inner side surface adjacent to the top surface is a cambered surface, and the cambered surface has a larger surface area than an inclined plane, thus the cambered surface can carry more adhesive. In this way, it is possible to effectively prevent the adhesive from flowing to the photosensitive region of the photosensitive chip.

Abstract: A camera module includes a circuit board; a photosensitive chip coupled to the circuit board, a package material body attached on the circuit board, and a support member mounted on the package material body. The package material body has a photosensitive surface, which includes a photosensitive region. The support member includes a support body and an extension structure. A side of the support body away from the package material body is coplanar with the extension structure. An orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region.

Abstract: A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.