Abstract: A camera module with no PCB that instead has a lens actuator/housing that has circuitry on a bottom surface thereof for direct electrical connection to a mobile electronic device. The housing further has a recess formed in the bottom surface thereof to receive an image sensor. The circuitry is three-dimensional in that it includes a first set of contact pads on one planar surface for connection to the mobile electronic device, a second set of contact pads on a planar surface within the recess for connection to the image sensor, and conductive traces that connect each of the contact pads of the first set with an associated one of the contact pads of the second set by having the trace follow a path from the first planar surface, along a intersecting third planar surface to the second planar surface.

Abstract: A novel camera module includes a housing having a lens unit receiving portion and an image capture device receiving portion, which includes a plurality of discrete support members. A lens unit is coupled to the lens unit receiving portion of the housing. An image capture device has a top surface, which includes an image sensor array. The top surface of the image capture device contacts the bottom of the discrete support members of the housing to align the tilt of the image capture device with respect to the housing. In a particular embodiment, the image capture device is mounted on a surface of a circuit substrate that is coupled to the housing. In an alternate embodiment, the housing is coupled directly to the image capture device.

Abstract: Systems and methods for ergonomic measurement are disclosed. For example, in one embodiment a method for ergonomic measurement includes: receiving a first signal from an image sensor, the first signal comprising data associated with a user's orientation with respect to the image sensor. A second signal is received from a orientation sensor, the second signal comprising data associated with the image sensor's orientation with respect to gravity. An ergonomic measurement of the user is determined based at least in part on the first and second signals. Another embodiment includes a computer-readable medium comprising processor-executable code for executing such a method.

Abstract: A hermetically sealed digital electronic camera that is designed to operate both on land and underwater to great depths, and method of making same. The present invention is a camera which is hermetically sealed by being totally encapsulated, preferably by being cast in plastic, with no seals, holes, joints, penetrating pins, wires or other objects. Wireless means are used for communicating information, electrical power and control signals. The invention is impervious to atmospheric contamination and absolutely incapable of leaking under water to great depths and pressures. In an alternate embodiment camera optics are not encapsulated but are immersed in water when the encapsulated digital camera is placed in water.

Abstract: A pop up prism camera (10) having a pop up prism lens assembly (11). A first lens assembly (14), a second lens assembly (18), and a prism assembly (21) are moved in relationship to a camera housing (12) controlled by a cam tube (20). The prism assembly (21) projects outside the camera housing (12) when the pop up prism camera (10) is in an operational configuration. A prism (100) of the prism assembly (21) redirects an optical path (48). A non-angled portion (44) of a first cam groove (30) causes the prism assembly (21) to remain fixed relative to the camera housing (12) while continued rotation of the cam tube (20) allows the first lens assembly (14) and the second lens assembly (18) to continue to move to accomplish a lens zoom function.

Abstract: A technique for assembling camera modules that includes attaching optical elements, such as an optics stack, directly to the upper surface of an image sensor. A housing may be provided to partially surrounded the optics stack. Alternatively, the housing can be provided by a transfer molding process. This technique can be applied in array processing scenario and solder balls can be attached to the bottom of the image sensor to provide an efficiently-produced and low cost camera module.

Abstract: An optical navigation device that can sense the movement of an object, such as a user's finger, so that the movement can control a feature of a consumer digital device such as a cursor on a display screen. The device includes a substrate to which an LED, reflector, and image sensor are attached. Light from the LED is directed by the elliptical reflector toward and through a window that is transparent to the light from the LED and then is reflected off of the user's finger back through the window, through a lens, and onto the image sensor. The reflector is positioned to direct light toward the window at an oblique angle, in the range of 65 to 70 degrees from an angle normal to the window. Further, the reflector is curved to gather light across a large solid angle in the vicinity of the LED. The curved shape of the reflector may be a portion of an ellipsoid and the LED may be located at one of the foci of the ellipsoid, with the window located at the other foci of the ellipsoid.

Abstract: A microelectronic image sensor assembly for backside illumination and method of making same are provided. The assembly includes a microelectronic element having contacts exposed at a front face and light sensing elements arranged to receive light of different wavelengths through a rear face. A semiconductor region has an opening overlying at least one of first and second light sensing elements, the semiconductor region having a first thickness between the first light sensing element and the rear face and a second thickness between the second light sensing element and the rear face. A light-absorbing material overlies the semiconductor region within the opening above at least one of the light sensing elements such that the first and second light sensing elements receive light of substantially the same intensity.

Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Abstract: A wafer level lens includes a first lens structure of a first polymeric material coupled to a second lens structure of a second polymeric material, wherein an interface is formed by opposing surfaces of the first lens structure and the second lens structure, the opposing surfaces having no air gap therebetween, at least one aperture disposed between the first lens structure and the second lens structure, wherein the aperture contacts the first lens structure and the second lens structure and wherein a supporting substrate is not positioned between the first lens structure and the second lens structure, and a spacer coupled to and separate from the wafer level lens.

Abstract: A camera module with a lens barrel containing a lens, and a lens carrier that slidably receives the lens barrel. Each of the exterior surface of the lens barrel and the interior surface of the lens carrier include a seating surface formed thereon. One of the exterior surface of the lens barrel and the interior surface of the lens carrier include a plurality of protrusions for controlling the relative position of the lens barrel and the lens carrier. The other of the exterior surface of the lens barrel and the interior surface of the lens carrier include a plurality of channels that are sized and arranged so as to slidably receive the protrusions to allow for the lens barrel to be slid into the lens carrier. The channels also each include a transverse section to allow the lens barrel to be pivoted about an optical axis of the lens barrel.

Abstract: Imaging apparatus includes an image sensor, which is adapted to generate an input image in response to optical radiation. A processing engine is configured to apply a digital filter, having a kernel width greater than five pixels, to the input image to generate a filtered image. An optical assembly is arranged to focus the optical radiation onto the image sensor with a point spread function such that no more than a first threshold percentage of energy emitted from a point object and focused by the optical assembly falls within a first region of the image sensor having a first width five times the pitch of the image sensor, while at least a second threshold percentage of the energy emitted from the point object and focused by the optical assembly falls within a second region, which contains the first region and has a second width corresponding to the kernel width.

Abstract: A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.