Abstract: A method of micro-devices transfer comprising following steps of: providing a flexible carrier including a plurality of grooves which are designed in positions corresponding one-to-one to a plurality of target surface portions of an outer surface of a target member, each of the grooves has an opening in a first surface of the flexible carrier; applying at least one external force to the flexible carrier such that the opening of each of the grooves is enlarged; placing a plurality of micro-devices in the grooves respectively; releasing the at least one external force such that the micro-devices are held by the grooves of the flexible carrier and auto-aligned in positions corresponding one-to-one to the target surface portions of the outer surface of the target member; aligning and bonding the micro-devices to the target surface portions of the outer surface of the target member; and removing the flexible carrier.