Patents Assigned to Nano-Dimension Technologies Ltd.
  • Patent number: 11629261
    Abstract: The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.
    Type: Grant
    Filed: June 19, 2020
    Date of Patent: April 18, 2023
    Assignee: Nano Dimension Technologies, Ltd.
    Inventor: Alik Belitzky
  • Patent number: 11580352
    Abstract: A device, system, and method is provided for storing a sparse neural network. A plurality of weights of the sparse neural network may be obtained. Each weight may represent a unique connection between a pair of a plurality of artificial neurons in different layers of a plurality of neuron layers. A minority of pairs of neurons in adjacent neuron layers are connected in the sparse neural network. Each of the plurality of weights of the sparse neural network may be stored with an association to a unique index. The unique index may uniquely identify a pair of artificial neurons that have a connection represented by the weight. Only non-zero weights may be stored that represent connections between pairs of neurons (and zero weights may not be stored that represent no connections between pairs of neurons).
    Type: Grant
    Filed: July 29, 2019
    Date of Patent: February 14, 2023
    Assignee: Nano Dimension Technologies, Ltd.
    Inventors: Eli David, Eri Rubin
  • Patent number: 11446858
    Abstract: The disclosure relates to systems, methods and compositions for fabricating composite component using additive manufacturing (AM). Specifically, the disclosure is directed to methods, systems and compositions for the fabrication of composite components having improved or modulated thermo-mechanical properties, as well as derivative dielectric strength, using for example, inkjet printing.
    Type: Grant
    Filed: June 26, 2020
    Date of Patent: September 20, 2022
    Assignee: Nano Dimension Technologies, LTD.
    Inventor: Alik Belitzky
  • Patent number: 11395412
    Abstract: The disclosure relates to systems and methods for using additive manufacturing techniques for fabricating ball grid array (BGA) surface mounting pads (SMP), and surface mounted technology devices (SMT) package sockets. More specifically, the disclosure relates to additive manufacturing methods for additively manufactured electronic (AME) circuits such as a printed circuit board (PCB), and/or flexible printed circuit (FPC), and/or high-density interconnect printed circuit board (HDIPCB) each having integrated raised and/or sunk BGA SMP, and or surface mounting sockets for SMT device(s) defined therein, and methods of coupling surface mounted devices such as BGA and/or SMT thereto.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: July 19, 2022
    Assignee: Nano Dimension Technologies, LTD.
    Inventors: Daniel Sokol, Aviram Lancovici
  • Patent number: 11351610
    Abstract: The disclosure relates to methods and compositions for direct printing of composite components. Specifically, the disclosure relates to the continuous printing of colored resin and metallic composite components using inkjet printing.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: June 7, 2022
    Assignee: Nano Dimension Technologies, LTD.
    Inventors: Sharon Fima, Hila Elimelech
  • Patent number: 11305541
    Abstract: The disclosure relates to a portable system for cleaning ink jet print heads. Specifically, the disclosure relates to external, portable systems and jig assemblies for cleaning clogged nozzles of ink jet print head under controlled pressure. The jig assembly can be self-contained and detachable, and can be programmed to operate upon receiving various signals indicating clogged nozzle plate or portion thereof, and/or as a routine maintenance operating procedure.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: April 19, 2022
    Assignee: Nano Dimension Technologies, LTD.
    Inventors: Tomer Friedman, Salamon Mekonen
  • Patent number: 11230133
    Abstract: The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles. Specifically, the disclosure relates to methods and systems for sintering ink compositions with metal nanoparticles using an illumination source comprising an array of pulsed light emitting diodes (LEDs).
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: January 25, 2022
    Assignee: Nano-Dimension Technologies Ltd.
    Inventor: Yochai Edlitz
  • Patent number: 11039541
    Abstract: The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.
    Type: Grant
    Filed: November 22, 2015
    Date of Patent: June 15, 2021
    Assignee: Nano Dimension Technologies, LTD.
    Inventors: Sharon Fima, Hila Elimelech
  • Patent number: 10980131
    Abstract: The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: April 13, 2021
    Assignee: Nano Dimension Technologies, Ltd.
    Inventor: Dan Kozlovski
  • Publication number: 20210046670
    Abstract: The disclosure relates to systems, methods and compositions for inkjet printing of ceramic dielectric portions. Specifically, the disclosure relates to systems, methods and compositions for the inkjet printing of three dimensional patterns formed from pre-ceramic polymer derived interpenetrated networks that are comprised of at least two phases, or bi-continuous phases, one formed by free radical polymerization and the other by sol-gel polymerization.
    Type: Application
    Filed: March 18, 2019
    Publication date: February 18, 2021
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventors: Hila Elimelech, Lior Yedidya
  • Patent number: 10905017
    Abstract: The disclosure relates to methods and compositions for direct printing of circuit boards having an electromagnetically-shielded tracks and/or components. Specifically, the disclosure relates to the direct, uninterrupted and continuous 3D printing of insulation-jacketed tracks and/or components with metallic shielding sleeves or capsule.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: January 26, 2021
    Assignee: Nano Dimension Technologies Ltd.
    Inventors: Avi Shabtai, Michael Partosh
  • Patent number: 10893612
    Abstract: The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: January 12, 2021
    Assignee: Nano Dimension Technologies Ltd.
    Inventors: Hila Elimelech, Einav Amit
  • Publication number: 20200376879
    Abstract: The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles.
    Type: Application
    Filed: March 23, 2018
    Publication date: December 3, 2020
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventor: Yochai Edlitz
  • Publication number: 20200315035
    Abstract: The disclosure relates to methods and compositions for direct printing of circuit boards having an electromagnetically-shielded tracks and/or components. Specifically, the disclosure relates to the direct, uninterrupted and continuous 3D printing of insulation-jacketed tracks and/or components with metallic shielding sleeves or capsule.
    Type: Application
    Filed: March 27, 2017
    Publication date: October 1, 2020
    Applicant: Nano Dimension Technologies, LTD.
    Inventors: Avi Shabtai, Michael Partosh
  • Patent number: 10626233
    Abstract: The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
    Type: Grant
    Filed: May 16, 2017
    Date of Patent: April 21, 2020
    Assignee: NANO-DIMENSION TECHNOLOGIES, LTD.
    Inventor: Hila Elimelech
  • Publication number: 20200070245
    Abstract: The disclosure relates to methods and compositions for direct printing of composite components. Specifically, the disclosure relates to the continuous printing of colored resin and metallic composite components using inkjet printing.
    Type: Application
    Filed: March 7, 2017
    Publication date: March 5, 2020
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventors: Sharon Fima, Hila Elimelech
  • Publication number: 20200037451
    Abstract: The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.
    Type: Application
    Filed: January 11, 2018
    Publication date: January 30, 2020
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventors: Hila Elimelech, Einav Amit
  • Publication number: 20190373738
    Abstract: The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.
    Type: Application
    Filed: January 24, 2018
    Publication date: December 5, 2019
    Applicant: NANO DIMENSIONS TECHNOLOGIES LTD.
    Inventor: Dan Kozlovski
  • Patent number: 10385175
    Abstract: The disclosure relates to thermosetting reinforced resin compositions and methods of forming boards, sheets and/or films using of porous particulates impregnated with embedded live monomer and/or oligomer and/or polymer configured to partially leach out a functional terminal end of the live monomer and/or oligomer and/or polymer and react with a cross-linking agent and photoinitiated polymer radicals to form a reinforced board, sheet and/or film of hybrid interpenetrating networks.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: August 20, 2019
    Assignee: Nano Dimension Technologies, LTD.
    Inventor: Hila Elimelech
  • Publication number: 20190098771
    Abstract: The disclosure relates to methods, kits and compositions for direct printing of double-sided and/or multilayered printed circuit boards. Specifically, the disclosure relates to the printing of conductive leads and insulating portions of printed circuit boards using inkjet printing.
    Type: Application
    Filed: November 22, 2015
    Publication date: March 28, 2019
    Applicant: Nano Dimension Technologies, LTD.
    Inventors: Sharon Fima, Hila Elimelech