Abstract: The disclosure relates to systems, methods and compositions for inkjet printing of ceramic dielectric portions. Specifically, the disclosure relates to systems, methods and compositions for the inkjet printing of three dimensional patterns formed from pre-ceramic polymer derived interpenetrated networks that are comprised of at least two phases, or bi-continuous phases, one formed by free radical polymerization and the other by sol-gel polymerization.

Abstract: The disclosure relates to systems and methods for photonic sintering of conductive ink compositions with metal nanoparticles.

Abstract: The disclosure relates to methods and compositions for direct printing of composite components. Specifically, the disclosure relates to the continuous printing of colored resin and metallic composite components using inkjet printing.

Abstract: The disclosure relates to methods and compositions for direct printing of rigid flexible electronic objects. Specifically, the disclosure relates to methods, systems and compositions for the direct, optionally simultaneous inkjet printing of rigid-flexible electronics, for example, rigid-flexible PCBs, FPCs, TFTs, antennae solar cells, RFIDs and the like, using a combination of print heads with flexible and rigid conductive and dielectric ink compositions.

Abstract: The disclosure relates to systems, methods and compositions for direct printing of printed circuit boards with embedded integrated chips. Specifically, the disclosure relates to systems methods and compositions for the direct, top-down inkjet printing of printed circuit board with embedded chip and/or chip packages using a combination of print heads with conductive and dielectric ink compositions, creating predetermined dedicated compartments for locating the chips and/or chip packages and covering these with an encapsulating layer while maintaining interconnectedness among the embedded chips. Placing of the chips can be done automatically using robotic arms.

Abstract: The disclosure relates to assemblies, kits and methods for alignment of inkjet print heads. More particularly, the disclosure relates to assemblies, kits and methods facilitating the alignment of inkjet printheads by selectably modulating the printheads' phase, registration, and yaw relative to the printing direction and optionally, with respect to an additional printhead or printheads.