Patents Assigned to NanoCoolers, Inc.
  • Patent number: 7475551
    Abstract: Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. In such configurations, it can be advantageous to discontinuously flow thermal transfer fluid into thermal contact with the hot or cold side of a thermoelectric module (TEM), allow it to dwell while heat is transferred from or to the TEM, and resume the flow. In configurations in which the TEM operation is itself discontinuous, various relationships between thermal transfer fluid flow and TEM operation can be advantageously employed to temporally integrate thermoelectric action.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: January 13, 2009
    Assignee: NanoCoolers, Inc.
    Inventor: Uttam Ghoshal
  • Patent number: 7296417
    Abstract: Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. In such configurations, it can be advantageous to configure fluid flows to provide heat transfer between hot-side and cold-side flows. For example, it can be desirable to substantially equilibrate temperature of liquid metal flows entering hot-side and cold-side paths. In this way, thermal differential (?T) across individual thermoelectric elements can be reduced, thereby improving efficiency of the thermoelectric. Various suitable recuperator designs are described including designs that provide heat exchange with and without mixture of respective flows.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: November 20, 2007
    Assignee: NanoCoolers, Inc.
    Inventor: Uttam Ghoshal
  • Patent number: 7293416
    Abstract: Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow liquid metal cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. Total cooling power can be increased by employing multiple thermoelectric elements. Indeed, by employing modern semiconductor technologies, including e.g., thin-film technologies, thermoelectric elements may be cost-effectively employed and configured in large arrays.
    Type: Grant
    Filed: December 23, 2004
    Date of Patent: November 13, 2007
    Assignee: NanoCoolers, Inc.
    Inventor: Uttam Ghoshal
  • Patent number: 7131286
    Abstract: Apparatus to provide effective removal of heat from a high power density device. The apparatus has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: November 7, 2006
    Assignee: NanoCoolers, Inc.
    Inventors: Uttam Ghoshal, Andrew Carl Miner
  • Patent number: 6708501
    Abstract: A system to provide effective removal of heat from a high power density device. The system has a heat spreader and a heat sink structure. The heat spreader is divided into one or more chambers. Electromagnetic pumps are placed inside each chamber in a configuration that facilitates easy circulation of liquid metal inside the chamber. The liquid metal preferably is an alloy of gallium and indium that has high electrical conductivity and high thermal conductivity. The liquid metal carries heat from a localized area (over the high power density device) and distributes it over the entire spreader. This results in a uniform distribution of heat on the base of the heat sink structure and hence effective removal of heat by the heat sink structure.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: March 23, 2004
    Assignee: Nanocoolers, Inc.
    Inventors: Uttam Ghoshal, Andrew Carl Miner
  • Patent number: 6658861
    Abstract: A system to extract heat from a high power density device and dissipate heat at a convenient distance. The system circulates liquid metal in a closed conduit using one or more electromagnetic pumps for carrying away the heat from high power density device and rejecting the heat at a heat sink located at a distance. The system may make use of a thermoelectric generator to power the electromagnetic pumps by utilizing the temperature difference between the inlet and outlet pipes of the heat sink. The system also provides networks of primary and secondary closed conduits having series and parallel arrangements of electromagnetic pumps for dissipating heat from multiple devices at a remotely located heat sink.
    Type: Grant
    Filed: December 6, 2002
    Date of Patent: December 9, 2003
    Assignee: Nanocoolers, Inc.
    Inventors: Uttam Ghoshal, Andrew Carl Miner