Abstract: New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.

Abstract: New types of circuit elements for integrated circuits include structures wherein a thickness dimension is much greater than a width dimension and is more closely spaced than the width dimension in order to attain a tight coupling condition. The structure is suitable to form inductors, capacitors, transmission lines and low impedance power distribution networks in integrated circuits. The width dimension is on the same order of magnitude as skin depth. Embodiments include a spiral winding disposed in a silicon substrate formed of a deep, narrow, conductor-covered spiral ridge separated by a narrow spiral trench. Other embodiments include a wide, thin conductor formed in or on a flexible insulative ribbon and wound with turns adjacent one another, or a conductor in or on a flexible insulative sheet folded into layers with windings adjacent one another Further, a method of manufacture includes directional etching of the deep, narrow spiral trench to form a winding in silicon.

Abstract: A system and method are provided for supplying bulk current to a voltage regulator embedded on a system-on-chip (SoC). An embedded voltage regulator (EVR) supplies a regulated voltage to a functional unit, the current demand is determined, and a current control signal is generated. An off-SoC bulk current source accepts the current control signal and supplies auxiliary (bulk) current to the functional unit in response to the current control signal. For example, in a first period of time a dynamic increase demand for a first current. Initially the EVR supplies the first current and creates an increase in SoC thermal loading. Subsequently, the EVR supplies a current less than the first current while the bulk current source supplies the bulk of the current. As a result, the bulk current source creates an off-SoC thermal load.