Abstract: In accordance with various embodiments of the present invention, mechanical systems incorporating movable microelectromechanical (MEMS)-based features, e.g., cantilevers or suspended micron- and submicron-scale beams are utilized to secure solid-state devices such as controllers, microcontrollers, central processing units (CPUs), solid-state storage drives, and memory cards. In various embodiments of the invention, the beams are double-clamped, initially curved (or “pre-buckled”) segments that are provided within the solid-state device (e.g., on the top layer thereof) prior to encapsulation and packaging of the device.