Abstract: An inspection device and a method of inspection, for optical examination of object surfaces, particularly wafer surfaces, wherein the object surface is illuminated by a first illumination device and a second illumination device, wherewith the light reflected and/or scattered from irregularities on the object surface is detected by means of a “scattered light detector” operating in the dark field of the first and second illumination devices, and wherewith the object surface is illuminated by a first illumination device and a second illumination device, wherewith the first illumination device has a laser for illuminating a measurement point on the object surface. The second illumination device is disposed (and oriented) to illuminate the same measurement point on the object surface but with a larger image spot, with the use of light of lower coherence and/or with less anisotropy than that of the laser.

Abstract: An inspection device and a method of inspection, for optical examination of object surfaces, particularly wafer surfaces, wherein the object surface is illuminated by a first illumination device and a second illumination device, wherewith the light reflected and/or scattered from irregularities on the object surface is detected by means of a “scattered light detector” operating in the dark field of the first and second illumination devices, and wherewith the object surface is illuminated by a first illumination device and a second illumination device, wherewith the first illumination device has a laser for illuminating a measurement point on the object surface. The second illumination device is disposed (and oriented) to illuminate the same measurement point on the object surface but with a larger image spot, with the use of light of lower coherence and/or with less anisotropy than that of the laser.

Abstract: A holding/turning device for touch-sensitive flat objects, in particular wafers, with a distance positioning device which is arranged for holding the object perpendicular to the object plane at a defined distance, a lateral positioning device, arranged for positioning the object in the object plane and for rotating together with the object about a rotational axis perpendicular to the object plane, and with a rotational drive, coupled with the lateral positioning device, providing a driving force for rotating the object about the rotational axis, wherein the driving force can be applied to the object by means of the lateral positioning device. The distance positioning device has means for holding the object without involving contact, and is decoupled from the rotational drive in such a way that the distance positioning device does not rotate together with the object.

Abstract: Semiconductor technology requires the use of object holders, which are capable of holding wafers securely, also during rotation. In order to save time and expense, such holders should be suitable for integration directly into a processing facility, wherever possible. According to the invention it is proposed to provide centrally mounted holders which comprise support surfaces for the wafer and pivotable gripper fingers, in which the gripper fingers are pretensioned by means of at least one pretension element in the holding position and are actuated through one opening mechanism, in which at least one opening mechanism and at least one pretension element are integrated in the central clamping arm fixture and/or in the clamping arms.

Abstract: A substrate measurement system including a measurement chamber and a substrate handling chamber possessing a substrate transfer and a substrate container interface arranged to receive a substrate to container. The handling chamber contains a first interface to connect the measurement chamber and the measurement chamber contains a second interface to connect the handling chamber. The transfer means is arranged to transfer substrates between the container and the measurement chamber through the handling chamber, in which system a second measurement chamber is provided, having the same second interface as the first measurement chamber to replace latter chamber.

Abstract: In view of the miniaturization of semiconductor components, the prevention of particles and other defects on the wafer surface during production is of great importance. The inspection should proceed as process-oriented as possible. For this purpose, devices are needed which on the one hand, are of very compact construction, while on the other hand, they still are equipped with measuring systems meeting the highest requirements. The device according to the invention for measuring surface defects, comprising a sample holder, a rotation drive for the sample holder, wherein the rotational axis runs perpendicular to the sample surface to be measured, an optical measuring system (10) for measuring scattered light, as well as at least one linear drive (23) for the measuring system, wherein the rotational direction is radial to the rotational axis of the sample holder, is capable of scanning the entire sample surface (16).

Abstract: A measurement device, i.e. a metrology tool, and a vehicle are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit, for, e.g., FOUPs in semiconductor manufacturing, an electronic control system with, e.g., a PC, monitor, and keyboard and optionally a vacuum pump is also provided in module frames of the vehicle. The measurement configuration particularly reduces bottleneck situations in equipment qualifying of processing tools during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool. With the possible exception of power supply or operator control, the measurement configuration can operate fully autonomously.

Abstract: A measurement box which can be integrated into existing wafer processing equipment. The measurement box comprises an enclosure which contains a measurement module for measuring objects such as the surfaces of wafers. The measurement module is equipped with a miniaturized measuring device and has a displaceable measuring head and a plane table with a rotatable wafer holder. The enclosure has at least one loading opening for the wafer to pass through as well as a ventilation device.

Abstract: To carry out measurements in the vacuum, for example for quality control in the production of semiconductors, conventional stand alone measuring machines are installed. They are very cost, space and time intensive. To enable a process oriented measurement under optimal conditions, a device with a two part case is proposed that can be moved in a vacuum chamber, whereby one part of the case projects into the vacuum chamber and the other part of the case is located outside the vacuum chamber. The case can receive a measurement system. In addition, an adjusting device, engaging with the case, and a counterpull device, engaging with the second part of the case, are provided.

Abstract: In view of the miniaturization of semiconductor components, the prevention of particles and other defects on the wafer surface during production is of great importance. The inspection should proceed as process-oriented as possible. For this purpose, devices are needed which on the one hand, are of very compact construction, while on the other hand, they still are equipped with measuring systems meeting the highest requirements.

Abstract: The present invention relates to a measuring module, whose measuring device comprises a measuring head equipped with a miniaturized measuring unit, and a spatially separately arranged control and evaluation unit, and wherein the measuring head is arranged so as to be able to slide linearly by means of a sliding drive.

Abstract: A measurement box which can be integrated into existing wafer processing equipment. The measurement box comprises an enclosure which contains a measurement module for measuring objects such as the surfaces of wafers. The measurement module is equipped with a miniaturized measuring device and has a displaceable measuring head and a plane table with a rotatable wafer holder. The enclosure has at least one loading opening for the wafer to pass through as well as a ventilation device.

Abstract: Substrate measurement system including a measurement chamber (30), and a substrate handling chamber (7) possessing substrate transfer means (10) and a substrate container interface (1) arranged to receive a substrate container (8), the handling chamber (7) containing an interface (50) to connect the measurement chamber (30), the measurement chamber (30) containing an interface (51) to connect to the handling chamber (7), and the transfer means (10) being arranged to transfer substrates between the container (8) and the measurement chamber (30) through the handling chamber (7), in which a second measurement chamber (39) is provided, having the same interface (51) as the first measurement chamber (30) to replace the latter chamber (30).

Abstract: A micropolarimeter and ellipsometer for obtaining complete optical information of superficially illuminated specimens. A compact construction is designed to facilitate their use. To obtain the simultaneous surface measurement of all optical information from a specimen, the retarder of the micropolarimeter consists of a one-piece retarder array with at least one pixel group, in which the major axis orientations of the individual pixels are distributed over an angular range of 360°. This micropolarimeter can be integrated into the reflected light microscope of an ellipsometer. The result is a compact measurement unit.

Abstract: Normally, repeated calibration measurements are necessary for the adjustment of the sample and ellipsometer. To achieve an automatic relative adjustment, a sample position detection system that can be adjusted in relation to the ellipsometer and locked in is assigned to the ellipsometer, and where the detection system is connected to an adjusting system that affects the sample table and/or the entire system detection system/ellipsometer. The method for automatic relative adjustment is provided for, that by initially using one sample, the system sample/ellipsometer is adjusted via the symmetry of the detector signal of the ellipsometer, and that the sample position detection system is adjusted and subsequently locked in with the ellipsometer. With all subsequent samples, a relative adjustment of sample and ellipsometer detection system is performed using the signals of the detection system.