Abstract: Permanent physical and electrical attachment of electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, is made to the electrically conductive contacts of a second component of the device, for example, a conductive area, such as an antenna. Attachment is achieved by co-depositing metal and electrically conductive hard particles upon the conductive contacts of either the first or second components and then using a non-conductive adhesive to provide permanent bond between the components and their conductive contacts.

Abstract: The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.

Abstract: A contact comprising an electrically conductive material plate defining a central planar contact base. A plurality of integral contact leaves extend spirally from the base, and a plurality of integral mounting tabs extend radially from the base. The leaves are mechanically deformed from the plane of the base to form independent spring contacts. The tabs are coplanar with the base. A metal plating containing interconnect particles is provided on the contact base and leaves.

Abstract: A flexible conductive tape is coated on at least one surface with an electrically conductive adhesive. The adhesive includes conductive particles dispersed therein. The adhesive-coated surface of a first segment of the flexible tape is joined to a substrate. The flexible tape is folded back at a crease, to expose a portion of the adhesive surface. At least one module is affixed to the exposed adhesive surface of the adjacent tape segment to form a sub-assembly. The sub-assembly is adapted for interengagement with a complementary modular assembly including electrical components and connectors. An electrical current is provided to the flexible tape.