Abstract: A wafer inspection device for inspecting presence or absence of a defect in a wafer, the wafer inspection device includes: a stage on which the wafer is horizontally floated above an air hole block by exhausting air from the air hole block; a transport unit to transport the wafer; an inspection information acquisition unit; and a detection unit, in which the transport unit includes an abutment unit that abuts against an outer peripheral edge of the wafer horizontally floated above the stage by the air, and a drive unit that moves the abutment unit with respect to the stage, and moves the wafer in the one direction by moving the abutment unit with respect to the stage by the drive unit, and allow the wafer to pass through the inspection information acquisition unit while horizontally floating the wafer.
Abstract: Provided is an exposure device capable of improving exposure accuracy while ensuring throughput. The exposure device 100 includes: a reflective liquid-crystal modulating device 21, 22; a light source device 10 uniformly illuminating the reflective liquid-crystal modulating device 21, 22 with power-stabilized pulsed laser light in a ultraviolet wavelength band; a projection optical system 30 forming an image of reflected light modulated by the reflective liquid-crystal modulating device 21, 22; and a stage 40 supporting a target on which exposure is performed by a pattern imaged by the projection optical system 30.
Abstract: There is provided an inspection device allowing surely measuring irregular-shaped parts such as a bevel of a wafer while saving space. An inspection device 100 is provided with outer periphery illuminating units 11, 111 for illuminating an outer peripheral region AP of a wafer WA being a target, and an outer periphery imaging unit that images the outer peripheral region AP of the wafer WA. The outer periphery illuminating units 11, 111 have arcuate illuminating units 11a, 111a that are arranged along a partial region of a circumference CI centered on a reference axis SA and illuminate a predetermined region A1 on the reference axis SA, and the reference axis SA of the arcuate illuminating units 11a, 111a extends in a direction crossing the tangent direction along which an outer peripheral part UA of the wafer WA extends.
Abstract: A projection exposure apparatus comprising: a display device having a reflection-type or transmission-type display portion on which a predetermined image to be exposed is displayed; a stage for holding a substrate to be exposed; and a telecentric-type projection lens for projecting the predetermined image displayed on the display portion onto the surface of the substrate held on the stage.
Type:
Grant
Filed:
November 10, 2000
Date of Patent:
November 22, 2005
Assignees:
National Institute of Advanced Industrial Science and Technology, NanoSystem Solutions, Inc.