Abstract: A method for using a smart EFEM in a semiconductor wafer process facility that incorporates at least one metrology testing device in a metrology unit positioned in operational proximity to the pre-alignment unit. The pre-alignment unit has a chuck that is used for both pre-alignment and for metrology, that two robotic arms shuttle the Si wafers onto while they are laying idle awaiting to be selected for processing. The metrology unit uses a bright elliptical scan light with light rays that are aligned in one axis and angled in another. The metrology scanning in the preferred embodiment is Bright Field-Dark Field metrology with coordinated motion between the metrology stage's movement, the rotation of the modulator wheel, the shuttering of the line scan cameras and if rotational scanning is performed, the rotation of the chuck. This provides a frame of reference for each scan image that eliminates or minimizes the need for image stitching.