Abstract: A spring copper alloy for electric and electronic parts having a high modulus of elasticity, a good electrical conductivity and a good solderability is disclosed, which alloy consists of 1.5.about.3.0% by weight of Ni, 1.2.about.2.0% by weight of Sn, 0.05.about.0.30% by weight of Mn, 0.01.about.0.1% by weight of P, inevitable impurities and the remainder of Cu.

Abstract: A spring material for electric and electronic parts having a high modulus of elasticity and good electrical conductivity. The material is made by melting Cu, Ni, Ti or mother alloy thereof and Cu--P as deoxidizer at a temperature between a melting point and 1,400.degree. C. to obtain a molten alloy consisting of 0.5.about.2.0% by weight of Ni, 0.1.about.1.0% by weight of Ti, less than 0.2% by weight of P and the remainder being Cu; casting the molten alloy into a metal mold to obtain an ingot; subjecting the ingot to hot (or warm) working, cold working and annealing; and finally rolling the annealed sheet above 50% and annealing it at low temperature with air cooling to obtain a formed product having a stable structure.