Abstract: A gold paste for painting glass or a ceramic, exhibits gold color by being sintered. The gold paste comprises metal components having a metal composition within the following range: gold 82.0-99.1% by weight, bismuth 5.0-0.4% by weight, silicon 3.0-0.2% by weight, and the total amount of zirconium and/or aluminum 10.0-0.3% by weight. According to this, it is possible to provide a gold paste making it possible to form a gold-decorated portion which does not generates conductivity, neither generates spark nor is damaged even if it is exposed to a microwave that a microwave oven emits, is good in a massive feel and development of gold color, and has high-class feeling; and a gold-decorated product using this paste.

Abstract: A ceramics dress substrate of the present invention capable of both performances of cutting a cut material with a high accuracy and dressing a diamond cutting grindstone with an excellent cutting property and an reduced wearing amount of the grindstone. This ceramics dress substrate comprises sintering a mixture of ceramics grinding particles and a silicate mineral, The ceramics grinding particles are preferably uniformed and have a scratch hardness ranging from 6 to 10. Alumina grinding particles, silicon carbide and mullite are preferably used as the ceramics grinding particles, and a kaolin mineral, pyrophyllite, montmorillonite, sericite, talc and chlorite are preferably used as the silicate mineral. The ceramics dress substrate is preferably coated with glass.

Abstract: A mouse pad which allows a mouse ball to rotate accompanied with the movement of a mouse accurately and prevents generation of static electricity and unpleasant frictional noise during operation of the mouse and collection of dust and fluff as well as exhibiting high impact resistance strength and flexural strength. The mouse pad for improving a controllability of the mouse as a computer input device is formed from a glass having a rugged pattern surface. An average roughness of the rugged pattern surface ranges from 2 to 20 .mu.m, and preferably from 2 to 8 .mu.m. It is also preferable that the glass is formed as a crystallized glass.

Abstract: A lead-free frit glaze consisting of, by mole %, 61% or greater SiO.sub.2, 8-10% Al.sub.2 O.sub.3, 0.1-3% CaO, 0.1-2% MgO, 2-5% Li.sub.2 O, 1-4% K.sub.2 O, 2-6% Na.sub.2 O, and 10-15% B.sub.2 O.sub.3. The glaze is applied over the surface of ceramic biscuit base and fired therewith. Although the glaze contains no lead, the lead-free frit glaze provides excellent gloss and excellent quick cooling resistance.

Abstract: A plasma display panel is disclosed, which comprises a pair of insulating substrates with a predetermined space therebetween; a group of anode electrodes and a group of cathode electrodes formed on the inner side of each of the insulating substrates in such a manner that the groups of the electrodes are normal to each other; and barriers formed on the insulating substrate having the anode electrodes thereon by photolithography. Since the barriers are formed by photolithography using an ultraviolet-curable resin or positive-type resist, high precison patterns having a line width of 100 .mu.m or less and a line spacing of 100 .mu.m or less can be easily obtained and, thereby, a high resolution plasma display having a decreased picture element area and a wider discharge space can be obtained. When photolithography is used in the formation of the cathode electrodes, further high precision fine patterns can be obtained and further finely detailed pitch of picture elements can be achieved.

Abstract: A dielectric ceramic composition consisting essentially of barium oxide, titanium oxide, neodymium oxide and gadolinium oxide and which is expressed by the formula:aBaO-bTiO.sub.2 -c[(1-X)Nd.sub.2 O.sub.3 -XGd.sub.2 O.sub.3 ]wherein, 0.10.ltoreq.a.ltoreq.0.20, 0.65.ltoreq.b.ltoreq.0.75, 0.10.ltoreq.c.ltoreq.0.20, a+b+c=1 (a, b, and c are mole fractions), and O<X.ltoreq.0.4 (X is a mole fraction of Gd.sub.2 O.sub.3 based on the total amount of Nd.sub.2 O.sub.3 and Gd.sub.2 O.sub.3).Al.sub.2 O.sub.3 may be added in an amount of not more than 4 parts by weight to 100 parts by weight of the dielectric ceramic composition.

Abstract: There is provided a dielectric porcelain used as dielectric resonator mainly in a microwave range. According to the present invention, 0.1 to 5.3 mol % of one or more of Tb.sub.4 O.sub.7, CeO.sub.2, TeO.sub.2, Gd.sub.2 O.sub.3 and Dy.sub.2 O.sub.3 as additive is admixed to a dielectric material Pb.sub.x Zr.sub.(1-x) O.sub.(2-x) wherein 0.42.ltoreq..ltoreq.0.69 to procure a dielectric constant while keeping the dielectric loss to a lower value and simultaneously controlling temperature characteristics of the dielectric constant, that is, temperature characteristics of the resonant frequency.

Abstract: Black sintered bodies of aluminum nitride are produced by adding a sintering aid selected from the group consisting of (a) an oxide mixture of calcium oxide and at least one of tungsten oxide and molybdenum oxide, (b) an oxide containing calcium and at least one of tungsten and molybdenum and (c) a mixture of compounds capable of being converted into said oxide mixture (a) or said oxide (b) by sintering to aluminum nitride so that the resulting composition consists essentially of 0.1 to 20 wt. % in the total amount (calculated as oxides of Ca, W and Mo) of the sintering aid and balance aluminum nitride, molding the composition and sintering the molded composition at relatively low temperature. The black sintered bodies thus obtained are especially useful as materials for insulating substrate, heat sink and packaging for semiconductor device due to their high density, good thermal conductivity and superior light-shielding ability.

Abstract: Sintered bodies of aluminum nitride are produced by adding, as a sintering aid, an oxide mixture consisting essentially of calcium oxide, yttrium oxide and one or more oxides of tungsten oxide and molybdenum oxide or a mixture of compounds (precursors) capable of being converted into said oxide mixture by firing to aluminum nitride as a main component in such proportions that total amounts of the sintering aid is in the range 0.1 to 20% by weight (calculated as oxides of CaO, Y.sub.2 O.sub.3, WO.sub.3 and MoO.sub.3) based on the sum of the weight as the oxide forms of the sintering aid and aluminum nitride, molding the resulting composition and sintering the molded composition. The composition can be sintered at relatively low temperature. The black sintered bodies thus obtained are especially useful as materials for insulating substrate, heat sink, packaging for semiconductor device, etc. due to their high density and good thermal conductivity.

Abstract: A dielectric ceramic composition consisting essentially of a BaO-TiO.sub.2 -WO.sub.3 ternary system wherein molar percentages of BaO, TiO.sub.2 and WO.sub.3 are within the range enclosed by a line joining the points of A(21.5, 78.5, 0), B(40.0, 30.0, 30.0), C(37.0, 30.0, 33.0), D(20.0, 75.0, 5.0), E(21.5, 75.0, 3.5) and A of a composition diagram shown in the attached FIGURE, the range excluding molar percentages of BaO, TiO.sub.2 and WO.sub.3 laying on a line joining said points A, E and D. In the dielectric ceramic composition, up to 10 mole % of TiO.sub.2 may be replaced by tetravalent metal oxide and, further, MnO is contained in amounts of 3 mole % or less with respect to 100 mole % of the sum of BaO, TiO.sub.2 and WO.sub.3. Since the dielectric ceramic composition has a beneficial combination of dielectric properties, particularly a high Q, properly small dielectric constant and sufficiently small temperature coefficient of resonant frequency, .tau..sub.f, and .tau..sub.

Abstract: A multilayer ceramic substrate with multilayered circuit patterns, the improvement in which internal conductors for wiring are formed by a Ag base conductive materials capable of being co-fired with multilayered green ceramic substrate sheets in an oxidizing atmosphere and external conductors electrically connected with the internal conductors are formed by a Cu base conductive material, the external Cu conductors being formed in such a manner so that a liquid phase of Cu-Ag is not formed at the interface of the Cu conductor and the Ag conductor. Further high reliable resistors of RuO.sub.2 or Bi.sub.2 Ru.sub.2 O.sub.7 type may be integrally formed onto and/or inside the substrate. In such an arrangement, problems or difficulties caused due to Ag migration, incomplete binder removal, solder leaching, etc., are eliminated and thereby there can be a multilayer substrate with a high reliability and a high pattern precision.

Abstract: A dielectric ceramic composition for microwave applications having the formula ##EQU1## wherein x, y and z are molar percentages and 10.ltoreq.x.ltoreq.22, 58.ltoreq.y.ltoreq.80 and 8.ltoreq.z.ltoreq.22, O<n.ltoreq.25, and x+y+z=100;M is at least one selected from the group consisting of Sr, Ca and Mg; andR is at least one selected from the group consisting of Nd, Sm and La.The dielectric ceramic composition may further contain at least one oxide selected from the group consisting of Cr.sub.2 O.sub.3, Fe.sub.2 O.sub.3, WO.sub.3, SnO.sub.2 and ZrO.sub.2 in the range of more than zero to 5 mole percent based on the total molar percentage of x, y and z and have a superior combination of properties, particularly a high dielectric constant, a large Q and a small .tau.f which adapt them especially to use at the microwave region (wherein Q is the reciprocal of dielectric loss tan .delta., i.e., Q=1/tan .delta.).

Abstract: Partially crystallized ceramic articles is prepared by firing at low temperatures of 800.degree. to 1100.degree. C., a mixture consisting essentially of, (a) 40 to 50 wt. % of powdered, noncrystalline glass consisting essentially of 10 to 55 wt. % of at least one selected from the group consisting of CaO and MgO, 45 to 70 wt. % of SiO.sub.2, 0 to 30 wt. % of Al.sub.2 O.sub.3, 0 to 30% of B.sub.2 O.sub.3 and up to 10% impurities, the powder size of said glass being at least 4.0 m.sup.2 /g in terms of specific surface area measured by the BET Method; and (b) 60 to 50 wt. % of powdered Al.sub.2 O.sub.3 and the ceramic article is composed essentially of a noncrystallized glass phase, alumina and at least one of crystallized glass phase among anorthite, wollastonite, cordierite and mullite formed by partially crystallizing the glass (a).

Abstract: A dielectric ceramic composition comprising a ternary system composition represented by the formula, aBaO.bTiO.sub.2.cWO.sub.3 (wherein a, b and c are percent molar fractions totaling 100, i.e., a+b+c=100; 17.ltoreq.a.ltoreq.21.5; 75.ltoreq.b.ltoreq.83 and 0.1.ltoreq.c.ltoreq.5) and characterized by an advantageous properties, particularly, high dielectric constant, large Q and small .tau.f. In the compositions, TiO.sub.2 may be partially replaced by ZrO.sub.2 and, optionally, MnO may be also included up to 3 mole percent based on the total molar amount of the foregoing ingredients. The dielectric ceramic compositions are especially, but not exclusively, useful in microwave applications because of the foregoing advantages.

Abstract: In a multilayer ceramic circuit board comprising a substrate, an insulating layer on the substrate, and a conductive pattern on the insulating layer, an additive of Cr.sub.2 O.sub.3 or MnO.sub.2 is added to the insulating layer to reinforce adhesion between the insulating layer and the conductive pattern. Each of the substrate and the insulating layer is manufactured by firing at a temperature between 800.degree. C. and 1000.degree. C., alumina particles and a glass composition comprising an alumina component. When a total amount of alumina in the substrate is equal to or greater than that in the insulating layer, an amount of Cr.sub.2 O.sub.3 or MnO.sub.2 is restricted to a range between 0.1% and 10.0% by weight, with a difference between the total amounts of alumina falling within a range between 0% and 30% by weight. When the total amount of alumina in the substrate is smaller than that in the insulating layer, the amounts of Cr.sub.2 O.sub.3 and MnO.sub.2 may be between 0.1% and 10.

Abstract: Low temperature fired ceramics are produced by a highly improved method, using a specially designed apparatus and the obtained ceramic products are very useful in various applications, such as electronic components, heat resistant articles, tablewares, kitchen utensils or decorative articles because of a combination of superior properties, particularly high heat resistance, high mechanical strength, low thermal expansion and low dielectric constant. In practicing the method, a low firable ceramic material is shaped into a green sheet and then converted to a dense fired ceramic product by rapid firing in an adequate air. In the firing step, the air feed ratio (the ratio of the quantity of feed of air to the theoretical quantity of air required for combustion) is controlled so as to be at least 1.5 thereby the aimed fired products can be obtained in a greatly reduced firing time, without causing deformation or warpage of the ceramics or ignition of the decomposition gases of a binder.

Abstract: In a package comprising a ceramic member so as to accommodate a semiconductor device, a composite metal body which comprises copper and either one of tungsten and molybdenum is brought into contact with the ceramic member. The composite metal body is provided by impregnating molten copper into a porous block of tungsten or molybdenum and changeable in a thermal expansion coefficient and a thermal conductivity by controlling an amount of copper. The composite metal block may be used as a support for supporting the semiconductor device and/or as a heat sink for dissipating heat radiated from the semiconductor device. Preferably, the composite metal body comprises, by weight, 1-30% of copper and 99-70% of tungsten or molybdenum.

Abstract: In an article comprising a ceramic body fired at a comparatively low temperature and a circuit pattern attached to the body, the ceramic body is produced from a preselected composition comprising first powder of alumina and second powder of a vitreous material which comprises any one of MgO-Al.sub.2 O.sub.3 -SiO.sub.2, CaO-MgO-Al.sub.2 O.sub.3 -SiO.sub.2, CaO-Al.sub.2 O.sub.3 -SiO.sub.2 glass, CaO-Al.sub.2 O.sub.3 -SiO.sub.2 -B.sub.2 O.sub.3 glass, MgO-Al.sub.2 O.sub.3 -SiO.sub.2 -B.sub.2 O.sub.3 glass, and CaO-MgO-Al.sub.2 O.sub.3 SiO.sub.2 -B.sub.2 O.sub.3 glass. The ceramic body comprises coexistence of an alumina part, a noncrystallized part, and a crystallized part and exhibits an excellent moisture proof. The circuit pattern comprises an internal conductive pattern of Ag and an external conductive pattern of an alloy of Ag-Pd. A chromium component may be included in the internal and the external conductive patterns.

Abstract: Low temperature fired ceramics produced by firing at a low temperature a mixture consisting of, in weight percentages:(a) 50 to 65% of powder glass consisting of 10 to 55% of CaO, 45 to 70% of SiO.sub.2, 0 to 30% of Al.sub.2 O.sub.3 and up to 10% of impurities; and(b) 50 to 35% of powder Al.sub.2 O.sub.3 containing up to 10% of impurities. The glass component (a) may further contains B.sub.2 O.sub.3 up to 20% based on the total weight of the former glass-forming components. The ceramics exhibit excellent thermal conductivity, high mechanical strength, low thermal expansion and small dielectric constant and such advantageous combination of properties make them useful in many applications, more especially highly suited to the use as substrate of various electronic parts, components or multilayer integrated circuits. Also, since the ceramics can be prepared at lower firing temperatures and a higher heating rate, the production cost and time can be advantageously saved.

Abstract: An electronic part mounting construction, such as a transistor package or a substrate for a resin mold device, has a substrate for mounting an electronic part on a principal surface, at least one metallized layer deposited on the principal surface and soldered to the electronic part thereon, another metallized layer continuously extended from the at least one metallized layer in a direction perpendicular thereto, and an insulator layer deposited on the other metallized layer. The other metallized layer is provided on a side surface of a wall member or the substrate. The other metallized layer and the insulator layer may be formed by steps of forming a hole in an insulator sheet, depositing a metallized layer and an insulator layer successively on the surface of the hole, and leaving the metallized layer and the insulator layer at predetermined region(s) by punching the insulator sheet.