Patents Assigned to NATIONAL CENTER FOR ADVANCED PACKAGE
  • Patent number: 11067459
    Abstract: The present invention discloses a stress sensor structure and a manufacturing method thereof, wherein the stress sensor structure comprises: a substrate; a blind-hole, provided on a first surface of the substrate; a first piezoresistive layer and a second piezoresistive layer, formed by material with piezoresistive effect, provided on a lateral wall of the blind-hole and interconnected at bottom portions of the layers; a second insulating layer, provided between the first piezoresistive layer and the second piezoresistive layer; a first electrode, provided on the first surface of the substrate and connected to the first piezoresistive layer; a second electrode, provided on the first surface of the substrate and connected to the second piezoresistive layer.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: July 20, 2021
    Assignee: NATIONAL CENTER FOR ADVANCED PACKAGE
    Inventors: Wen Yin, Heng Yang, Chuanguo Dou, Wenqi Zhang, Tingyu Lin, Liqiang Cao