Patents Assigned to National Center for Advanced Packaging (NCAP China)
  • TSV Backside Reveal Structure and Exposing Process
    Publication number: 20140327132
    Abstract: A TSV backside reveal structure is provided, formed by a TSV conductive column on a substrate running throughout the substrate front surface and substrate back surface and stretching out of the substrate back surface; wherein, a sloping buffer is formed within the region between the substrate back surface and the TSV, and the height of the sloping buffer changes continuously; wherein the region close to the TSV has the highest height and the height of the buffer gradually decreases to that of the substrate back surface.
    Type: Application
    Filed: November 4, 2013
    Publication date: November 6, 2014
    Applicant: National Center for Advanced Packaging (NCAP China)
    Inventors: Wenqi ZHANG, Haiyang GU, Chongshen SONG
  • TSV Backside Reveal Structure and Exposing Process
    Publication number: 20140329381
    Abstract: A TSV exposing process is provided, including: performing a mechanical grinding process on the substrate back surface of a substrate with a TSV conductive column, a liner between the substrate and the TSV conductive column; performing a first and a second chemical mechanical polishing process on the grinded substrate back surface; then performing an etching on the substrate back surface, and making the TSV backside reveal more than 10 ?m.
    Type: Application
    Filed: November 4, 2013
    Publication date: November 6, 2014
    Applicant: National Center for Advanced Packaging (NCAP China)
    Inventors: Wenqi ZHANG, Haiyang GU, Chongshen SONG