Abstract: A semiconductor substrate includes a single crystal Ga2O3-based substrate and a polycrystalline substrate that are bonded to each other. A thickness of the single crystal Ga2O3-based substrate is smaller than a thickness of the polycrystalline substrate, and a fracture toughness value of the polycrystalline substrate is higher than a fracture toughness value of the single crystal Ga2O3-based substrate.
Type:
Grant
Filed:
July 9, 2018
Date of Patent:
March 1, 2022
Assignees:
TAMURA CORPORATION, SICOXS Corporation, National Institute of Information and Commnications Technology